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参数资料
| 型号： | AT3228ZG10ZS-RV |
| 厂商： | Kingbright Corp |
| 文件页数： | 10/10页 |
| 文件大小： | 430K |
| 描述： | LED 520NM GREEN 3.2X2.8MM SMD |
| 标准包装： | 2,000 |
| 颜色： | 绿 |
| 电流 - 最大： | 350mA |
| 正向电压： | 3.3V |
| 流明 @ 电流 - 最大： | 55 lm |
| 在特定电流下的光通量 - 测试： | 55 lm |
| 流明/瓦 @ 电流 - 测试： | 48 lm/W |
| 电流 - 测试： | 350mA |
| 波长： | 520nm |
| 透镜样式/尺寸： | 圆形，带圆顶，2.3mm |
| 视角： | 120° |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 1201（3228 公制） |
| 包装： | 带卷 (TR) |
3.2X2.8mm SMD LED WITH CERAMIC SUBSTRATE
SPEC NO: DSAI6847 REV NO: V.7 DATE: APR/13/2011
PAGE: 9 OF 10
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000023
Designing the Position of LED on a Board.
1.No twist/warp/bent/or other stress shall be applied to the board after mounting LED with
solder to avoid a crack of LED package.
Refer to the following recommended position and direction of LED.
Appropriate LED mounting is to place perpendicularly against the stress affected side.
2.Depending on the position and direction of LED,the mechanical stress on the LED package can be changed.
Refer to the following figure.
3.Do not split board by hand.Split with exclusive special tool.
4.If an aluminum circuit board is used,a large stress by thermal shock might cause a solder crack.
For this reason,it is recommended an appropr
iate verification should be taken before use.
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