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参数资料
| 型号： | AT84AD004CTD |
| 厂商： | ATMEL CORP |
| 元件分类： | ADC |
| 英文描述： | DUAL 8 BIT 500 MSPS ADC |
| 中文描述： | 2-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQFP144 |
| 封装： | 20 X 20 MM, 1.4 MM HEIGHT, LQFP-144 |
| 文件页数： | 54/58页 |
| 文件大小： | 1023K |
| 代理商： | AT84AD004CTD |
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54
AT84AD004
5390A–BDC–06/04
Thermal Characteristics
Simplified Thermal
Model for LQFP 144
20 x 20 x 1.4 mm
The following model has been extracted from the ANSYS FEM simulations.
Assumptions: no air, no convection and no board.
Figure 57.
Simplified Thermal Model for LQFP Package
Note:
The above are typical values with an assumption of uniform power dissipation over 2.5 x 2.5 mm
2
of the top surface of the die.
Thermal Resistance from
Junction to Bottom of Leads
Assumptions: no air, no convection and no board.
The thermal resistance from the junction to the bottom of the leads is 15.2
°
C/W typical.
Thermal Resistance from
Junction to Top of Case
Assumptions: no air, no convection and no board.
The thermal resistance from the junction to the top of the case is 8.3
°
C/W typical.
Thermal Resistance from
Junction to Bottom of Case
Assumptions: no air, no convection and no board.
The thermal resistance from the junction to the bottom of the case is 6.4
°
C/W typical.
Thermal Resistance from
Junction to Bottom of Air Gap
The thermal resistance from the junction to the bottom of the air gap (bottom of pack-
age) is 17.9
°
C/W typical.
355 μm silicon die
25 mm
λ
= 0.95W/cm/C
40 μm Epoxy/Ag glue
λ
= 0.02 W/cm/C
Copper paddle
λ
= 2.5W/cm/C
Aluminium paddle
λ
= 0.75W/cm/C
Copper alloy leadframe
λ
= 25W/cm/C
Package top
5.5C/watt
0.1C/watt
11.4C/watt
Package
bottom
4.3C/watt
1.5C/watt
λ
= 0.007W/cm/C
Silicon Junction
0.6C/watt
8.3C/watt
1.4C/watt
0.1C/watt
6.1C/watt
1.5C/watt
Leads tip
Assumptions:
Die 5.0 x 5.0 = 25 mm
40
μ
m thick Epoxy/Ag glue
2
Top of user board
Package bottom
connected to:
(user dependent)
Resin bottom
λ
= 0.007W/cm/
C
2
Aluminium paddle
Resin
Resin
λ
= 0.007W/cm/C
100
μ
m air gap
λ
= 0.00027W/cm/
C
100
μ
m thermal grease gap diamater 12 mm
λ
= 0.01W/cm/
C
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AT84AD004TD | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:DUAL 8 BIT 500 MSPS ADC |
| AT84AD004TDEB | 制造商:e2v technologies 功能描述:EVALUATION BOARD FOR DUAL-BIT 500 MSPS ADC |
| AT84AD004TD-EB | 制造商:e2v technologies 功能描述:EVAL BOARD DUAL 8 BIT ADC 1 GSPS - Trays |
| AT84AD004VTD | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:DUAL 8 BIT 500 MSPS ADC |
| AT84AS001CTPY | 制造商:e2v technologies 功能描述:ADC SGL 500MSPS 12-BIT LVDS 192PIN EBGA - Trays |
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