参数资料
型号: AT88SA102S-SH-T
厂商: Atmel
文件页数: 15/25页
文件大小: 0K
描述: IC BATTERY AUTHENTICATION 8SOIC
产品培训模块: CryptoAuthentication™ Introduction
标准包装: 4,000
系列: CryptoAuthentication™
类型: 验证芯片
应用: 网络和通信
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
22
8.
Packaging Information
3TS1 – 3-lead Shrink SOT
TITLE
DRAWING NO.
GPC
REV.
3TS1
12/11/09
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
End View
Side View
Top View
3TS1, 3-lead, 1.30mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
B
TBG
0.89
0.01
0.88
2.80
2.10
1.20
0.30
A
A1
A2
D
E
E1
L1
e1
b
-
2.90
-
1.30
0.54 REF
1.90 BSC
-
1.12
0.10
1.02
3.04
2.64
1.40
0.50
1,2
3
Notes:
1. Dimension D does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.25mm per
end. Dimension E1 does not include interlead flash or protrusion.
Interlead flash or protrusion shall not exceed 0.25mm per side.
2. The package top may be smaller than the package bottom.
Dimensions D and E1 are determined at the outermost extremes of
the plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash, but including any mismatch between the top and
bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08
mm and 0.15mm from the lead tip.
This drawing is for general information only. Refer to JEDEC Drawing
TO-236, Variation AB for additional information.
C
L
L1
3
E
E1
1
2
e1
SEATING
PLANE
b
A2
A
A1
e
D
GND
SDA
VCC
Package Drawing Contact:
packagedrawings@atmel.com
Signal
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