参数资料
型号: AT88SC12816C-SU
厂商: Atmel
文件页数: 19/21页
文件大小: 0K
描述: IC EEPROM 128KBIT 1.5MHZ 8SOIC
产品培训模块: Crypto Products
CryptoAuthentication™ Introduction
标准包装: 12,000
系列: CryptoMemory®
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 128K (16K x 8)
速度: 5MHz
接口: I²C,2 线串口
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
AT88SC12816C
15.2.
Ordering Code: PU
8P3 – PDIP
1
E
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
D1
D
e
A2 A
SYMBOL
A
(Unit of Measure = inches)
MIN NOM MAX
? ? 0.210
NOTE
2
A2
0.115
0.130
0.195
b
b2
b3
c
D
0.014
0.045
0.030
0.008
0.355
0.018
0.060
0.039
0.010
0.365
0.022
0.070
0.045
0.014
0.400
5
6
6
3
b3
4 PLCS
b2
b
L
D1
E
E1
0.005
0.300
0.240
?
0.310
0.250
?
0.325
0.280
3
4
3
Side View
e
eA
0.100 BSC
0.300 BSC
4
L
0.115
0.130
0.150
2
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional
information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not
exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed
0.010 (0.25 mm).
01/09/02
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
DRAWING NO.
8P3
REV.
B
19
5016KS–SMEM–08/09
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