参数资料
型号: AT89C51RB2-3CSUL
厂商: Atmel
文件页数: 121/127页
文件大小: 0K
描述: MCU 8051 16K FLASH 3V 44-PLCC
产品培训模块: MCU Product Line Introduction
标准包装: 216
系列: 89C
核心处理器: 8051
芯体尺寸: 8-位
速度: 40MHz
连通性: SPI,UART/USART
外围设备: POR,PWM,WDT
输入/输出数: 32
程序存储器容量: 16KB(16K x 8)
程序存储器类型: 闪存
RAM 容量: 1.25K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 3.6 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 40-DIP(0.600",15.24mm)
包装: 管件
配用: AT89STK-11-ND - KIT STARTER FOR AT89C51RX2
93
AT89C51RB2/RC2
4180E–8051–10/06
Bootloader Functionality
Introduction
The bootloader can be activated by two means: Hardware conditions or regular boot
process.
The Hardware conditions (EA = 1, PSEN = 0) during the Reset# falling edge force the
on-chip bootloader execution. This allows an application to be built that will normally
execute the end user’s code but can be manually forced into default ISP operation.
As PSEN is an output port in normal operating mode (running user application or boor-
loader code) after reset, it is recommended to release PSEN after falling edge of reset
signal. The hardware conditions are sampled at reset signal falling edge, thus they can
be released at any time when reset input is low.
To ensure correct microcontroller startup, the PSEN pin should not be tied to ground
during power-on (See Figure 38).
Figure 38. Hardware conditions typical sequence during power-on.
The on-chip bootloader boot process is shown in Figure 39.
VCC
PSEN
RST
Purpose
Hardware Conditions
The Hardware Conditions force the bootloader execution whatever BLJB, BSB
and SBV values.
BLJB
The Boot Loader Jump Bit forces the application execution.
BLJB = 0 => Boot loader execution.
BLJB = 1 => Application execution.
The BLJB is a fuse bit in the Hardware Byte.
That can be modified by hardware (programmer) or by software (API).
Note:
The BLJB test is perform by hardware to prevent any program execution.
SBV
The Software Boot Vector contains the high address of custumer bootloader
stored in the application.
SBV = FCh (default value) if no custumer bootloader in user Flash.
Note:
The costumer bootloader is called by JMP [SBV]00h instruction.
相关PDF资料
PDF描述
DSPIC30F2020-30I/SP IC DSPIC MCU/DSP 12K 28DIP
PIC18F4515-I/PT IC MCU FLASH 24KX16 44TQFP
PIC18F97J60-I/PT IC PIC MCU FLASH 64KX16 100TQFP
PIC18F2525-I/SO IC MCU FLASH 24KX16 28SOIC
PIC18F4431-I/PT IC PIC MCU FLASH 8KX16 44TQFP
相关代理商/技术参数
参数描述
AT89C51RB2-3CSUM 功能描述:8位微控制器 -MCU C51RB2 FLASH 5V 16k ind RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
AT89C51RB2L1-RLTUL 功能描述:8位微控制器 -MCU Microcontroller RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
AT89C51RB2-RLRIL 功能描述:IC MCU FLASH 8051 16K 3V 44-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:89C 标准包装:1,500 系列:AVR® ATtiny 核心处理器:AVR 芯体尺寸:8-位 速度:16MHz 连通性:I²C,LIN,SPI,UART/USART,USI 外围设备:欠压检测/复位,POR,PWM,温度传感器,WDT 输入/输出数:16 程序存储器容量:8KB(4K x 16) 程序存储器类型:闪存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 电压 - 电源 (Vcc/Vdd):2.7 V ~ 5.5 V 数据转换器:A/D 11x10b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:20-SOIC(0.295",7.50mm 宽) 包装:带卷 (TR)
AT89C51RB2-RLRIM 功能描述:IC MCU FLASH 8051 16K 5V 44-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:89C 产品培训模块:MCU Product Line Introduction AVR® UC3 Introduction 标准包装:2,500 系列:AVR®32 UC3 B 核心处理器:AVR 芯体尺寸:32-位 速度:60MHz 连通性:I²C,IrDA,SPI,SSC,UART/USART,USB 外围设备:欠压检测/复位,DMA,POR,PWM,WDT 输入/输出数:28 程序存储器容量:128KB(128K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:32K x 8 电压 - 电源 (Vcc/Vdd):1.65 V ~ 1.95 V 数据转换器:A/D 6x10b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:48-TQFP 包装:带卷 (TR) 配用:ATSTK600-TQFP48-ND - STK600 SOCKET/ADAPTER 48-TQFPATAVRONEKIT-ND - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1101-ND - KIT DEV/EVAL FOR AVR32 AT32UC3B 其它名称:AT32UC3B1128-AUR-NDAT32UC3B1128-AURTR
AT89C51RB2-RLRUL 功能描述:8位微控制器 -MCU C51RB2 FLASH 3V 16k ind RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT