参数资料
型号: AT90LS8535-4AI
厂商: Atmel
文件页数: 18/127页
文件大小: 0K
描述: IC MCU 8K 4MHZ A/D LV IT 44TQFP
标准包装: 160
系列: AVR® 90LS
核心处理器: AVR
芯体尺寸: 8-位
速度: 4MHz
连通性: SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 32
程序存储器容量: 8KB(4K x 16)
程序存储器类型: 闪存
EEPROM 大小: 512 x 8
RAM 容量: 512 x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 6 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 44-TQFP
包装: 托盘
PIC16C71X
DS30272A-page 114
1997 Microchip Technology Inc.
Applicable Devices
710 71 711 715
13.2
DC Characteristics:
PIC16LC715-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
0C
≤ TA ≤ +70C (commercial)
-40C
≤ TA ≤ +85C (industrial)
Param
No.
Characteristic
Sym
Min
Typ Max Units
Conditions
D001
Supply Voltage
VDD
2.5
-
5.5
V
LP, XT, RC osc conguration (DC - 4 MHz)
D002*
RAM Data Retention
Voltage (Note 1)
VDR
-
1.5
-
V
Device in SLEEP mode
D003
VDD start voltage to
ensure internal
Power-on Reset
signal
VPOR
-
VSS
-
V
See section on Power-on Reset for details
D004*
VDD rise rate to
ensure internal
Power-on Reset
signal
SVDD
0.05
-
V/ms See section on Power-on Reset for details
D005
Brown-out Reset
Voltage
BVDD
3.7
4.0
4.3
V
BODEN conguration bit is enabled
D010
D010A
Supply Current
(Note 2)
IDD
-
2.0
22.5
3.8
48
mA
A
XT, RC osc conguration
FOSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc conguration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D015
Brown-out Reset
Current (Note 5)
IBOR
-
300*
500
A
BOR enabled VDD = 5.0V
D020
D021
D021A
Power-down Current
(Note 3)
IPD
-
7.5
0.9
30
5
A
VDD = 3.0V, WDT enabled, -40
°C to +85°C
VDD = 3.0V, WDT disabled, 0
°C to +70°C
VDD = 3.0V, WDT disabled, -40
°C to +85°C
D023
Brown-out Reset
Current (Note 5)
IBOR
-
300*
500
A
BOR enabled VDD = 5.0V
*
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD
MCLR = VDD; WDT enabled/disabled as specied.
3:
The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4:
For RC osc conguration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.
5: The
current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
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