参数资料
| 型号： | AT91SAM9N12-CU |
| 厂商： | Atmel |
| 文件页数： | 10/27页 |
| 文件大小： | 0K |
| 描述： | IC MCU ARM9 217-LFBGA |
| 标准包装： | 126 |
| 系列： | SAM9N |
| 核心处理器： | ARM9 |
| 芯体尺寸： | 16/32-位 |
| 速度： | 400MHz |
| 连通性： | EBI/EMI，I²C，MMC，SPI，SSC，UART/USART，USB |
| 外围设备： | DMA，LCD，POR，PWM，WDT |
| 输入/输出数： | 105 |
| 程序存储器容量： | 128KB（128K x 8） |
| 程序存储器类型： | ROM |
| RAM 容量： | 32K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 0.9 V ~ 1.1 V |
| 数据转换器： | A/D 12x10b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | * |
| 包装： | * |
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18
11096AS–ATARM–4-Oct-11
SAM9N12
6.1
Memory Mapping
A first level of address decoding is performed by the AHB Bus Matrix, i.e., the implementation of
the Advanced High performance Bus (AHB) for its Master and Slave interfaces with additional
features.
Decoding breaks up the 4 Gbytes of address space into 16 banks of 256 Mbytes. The banks 1 to
6 are directed to the EBI that associates these banks to the external chip selects EBI_NCS0 to
EBI_NCS5. The bank 0 is reserved for the addressing of the internal memories, and a second
level of decoding provides 1Mbyte of internal memory area. The bank 15 is reserved for the
peripherals and provides access to the Advanced Peripheral Bus (APB).
Other areas are unused and performing an access within them provides an abort to the master
requesting such an access.
6.2
Embedded Memories
6.2.1
Internal SRAM
The SAM9N12 embeds a total of 32 Kbytes high-speed SRAM.
After reset and until the Remap Command is performed, the SRAM is only accessible at address
0x0030 0000.
After Remap, the SRAM also becomes available at address 0x0.
6.2.2
Internal ROM
The SAM9N12 contains the bootloader and specific tables used to compute SLC and MLC
NAND Flash ECC.
The ROM is mapped at address 0x0010 0000. It is also accessible at address 0x0 (BMS = 1)
after the reset and before the Remap Command.
相关PDF资料 |
PDF描述 |
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| AT91SAM9R64-CU-999 | IC MCU ARM9 32KB ROM 144LFBGA |
| AT91SAM9XE512-QU | MCU ARM9 512K FLASH 208-PQFP |
| AT97SC3204-X1A50-1 | CRYPTO TPM LPC 3.0-3.6V 28TSSOP |
| ATA6620N-TAQY | TXRX LIN BUS W/VREG SO-8 |
| ATA6661-TAQJ 19 | TXRX LIN 2.0 3.3V/5V 8SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AT91SAM9N12-CUR | 制造商:Atmel Corporation 功能描述:BGA,GREEN,IND TEMP,MRL A,T&R 制造商:Atmel Corporation 功能描述:BGA,GREEN,IND TEMP,MRL A,T&R - Tape and Reel 制造商:Atmel Corporation 功能描述:IC MCU ARM9 ROM 217BGA 制造商:Atmel Corporation 功能描述:BGA GREEN,IND TEMP,MRL A |
| AT91SAM9N12-EK | 功能描述:开发板和工具包 - ARM EVAL KIT SAM9N12 RoHS:否 制造商:Arduino 产品:Development Boards 工具用于评估:ATSAM3X8EA-AU 核心:ARM Cortex M3 接口类型:DAC, ICSP, JTAG, UART, USB 工作电源电压:3.3 V |
| AT91SAM9R64 | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:Thumb Microcontrollers |
| AT91SAM9R64_09 | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:AT91 ARM Thumb Microcontrollers |
| AT91SAM9R64-CU | 功能描述:ARM微控制器 - MCU ARM Thumb MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
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