参数资料
型号: AT93C56AY1-10YI-1.8
厂商: Atmel
文件页数: 14/23页
文件大小: 0K
描述: IC EEPROM 2KBIT 2MHZ 8MAP
标准包装: 120
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 2K(256 x 8 或 128 x 16)
速度: 250kHz,1MHz,2MHz
接口: Microwire 3 线串行
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-UDFN 裸露焊盘
供应商设备封装: 8-MAP(3x4.9)
包装: 管件
其它名称: AT93C56AY110YI1.8
8. Packaging Information
8.1
8P3 – PDIP
1
E
E1
N
Top View
c
eA
End View
D
e
COMMON DIMENSIONS
(Unit of Measure = inches)
D1
A2 A
SYMBOL
MIN
NOM
MAX
NOTE
A
0.210
2
A2
0.115
0.130
0.195
b
b2
b3
c
D
0.014
0.045
0.030
0.008
0.355
0.018
0.060
0.039
0.010
0.365
0.022
0.070
0.045
0.014
0.400
5
6
6
3
b2
L
D1
0.005
3
b3
4 PLCS
b
E
E1
0.300
0.240
0.310
0.250
0.325
0.280
4
3
Side View
e
eA
0.100 BSC
0.300 BSC
4
L
0.115
0.130
0.150
2
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
R
2325 Orchard Parkway
San Jose, CA 95131
8P3 , 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
8P3
B
14
AT93C56A/66A
3378O–SEEPR–11/09
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AT93C56AY1-10YI-2.7 功能描述:IC EEPROM 2KBIT 2MHZ 8MAP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:96 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:16M(2M x 8,1M x 16) 速度:70ns 接口:并联 电源电压:2.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘
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AT93C56AY1-10YU-1.8 SL383 制造商:Atmel Corporation 功能描述:EEPROM SERL-3WIRE 2KBIT 256X8/128X16 2.5V/3.3V/5V 8MAP - Tape and Reel
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