参数资料
型号: AT93C56AY6-10YH-1.8
厂商: Atmel
文件页数: 17/23页
文件大小: 0K
描述: IC EEPROM 2KBIT 2MHZ 8DFN
产品变化通告: AT93C56,66A Obsolescence 27/Oct/2011
标准包装: 1
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 2K(256 x 8 或 128 x 16)
速度: 250kHz,1MHz,2MHz
接口: Microwire 3 线串行
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-UDFN 裸露焊盘
供应商设备封装: 8-MLP(2x3)
包装: 标准包装
产品目录页面: 1457 (CN2011-ZH PDF)
其它名称: AT93C56AY6-10YH-1.8DKR
AT93C56A/66A
8.4
8Y6 – MiniMap (MLP 2x3)
A
D2
b
(8X)
Pin 1
Index
Area
Pin 1 ID
L (8X)
D
A2
A1
e (6X)
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D
E
2.00 BSC
3.00 BSC
D2
E2
A
A1
A2
A3
L
e
1.40
-
-
0.0
-
0.20
1.50
-
-
0.02
-
0.20 REF
0.30
0.50 BSC
1.60
1.40
0.60
0.05
0.55
0.40
b
0.20
0.25
0.30
2
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
11/21/08
TITLE
GPC
DRAWING NO.
REV.
Package Drawing Contact:
packagedrawings@atmel.com
8Y6, 8-lead 2.0x3.0 mm Body, 0.50 mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package
YNZ
8Y6
E
(Sawn)(UDFN)
17
3378O–SEEPR–11/09
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