参数资料
型号: AUIRG7CH80K6B-M
元件分类: IGBT 晶体管
英文描述: 1200 V, N-CHANNEL IGBT
封装: 12 X 12 MM, DIE-3
文件页数: 1/3页
文件大小: 89K
代理商: AUIRG7CH80K6B-M
www.irf.com
1
01/12/10
AUIRG7CH80K6B-M
Features
Designed for Automotive Application
**
Solderable Front Metal
Low VCE (on) Trench IGBT Technology
Low Switching Losses
Maximum Junction Temperature 175 °C
Short Circuit Rated
Square RBSOA
Positive VCE (on) Temperature Coefficient
Tight Parameter Distribution
Applications
Medium/High Power Inverters
HEV/EV Inverter
E
C
G
n-channel
Note:
* This IR product is 100% tested at wafer level and is manufactured using established, mature and well characterized processes. Due to
restrictions in die level processing, die may not be equivalent to standard package products and are therefore offered with a conditional
performance guarantee. The above data sheet is based on IR sample testing under certain predetermined and assumed conditions,
and are provided for illustration purposes only. Customers are encouraged to perform testing in actual proposed package and use
conditions. IR die products are tested using IR-based quality assurance procedures and are manufactured using IR’s established
processes. Programs for customer-specified testing are available upon request. IR has experienced assembly yields of generally 95%
or greater for individual die; however, customer’s results will vary. Estimates such as those described and set forth in this data sheet for
semiconductor die will vary depending on a number of packaging, handling, use and other factors. Sold die may not perform on an
equivalent basis to standard package products and are therefore offered with a limited warranty as described in IR’s applicable standard
terms and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale, which are available
upon request. For customers requiring a particular parameter to be guaranteed, special testing can be carried out or product can
bepurchased as known good die.
** Technology qualified in sup-TO247 package according to AEC-Q101.
100% Tested at Probe
*
Benefits
High Efficiency in a Wide Range of Applications
Suitable for a Wide Range of Switching Frequencies
due to Low VCE (on) and Low Switching Losses
Rugged Transient Performance for Increased
Reliability
Excellent Current Sharing in Parallel Operation
Enables Double side cooling and higher current density
Eliminates wire bonds and Improves Reliability
AUTOMOTIVE GRADE
PD - 96279
Mechanical Parameter
m
Wafer Size
mm
Degrees
Front Metal
Backside Metal
Reject Ink Dot Size
Recommended Storage Environment
mm2
89 pcs
Silicon Nitride
150
0
Thickness
Flat Position
Maximum-Possible Chips per Wafer
Passivation Frontside
Die Size
Emiter Pad Size (Included Gate Pad)
Gate Pad Size
Area Total / Active
12.075x12.075
See Die Drawing
Round, 1mm diameter
144/114
140
Al (4m), Ti (0.1m), Ni (0.2m), Ag (0.6m)
Al (0.1m), Ti (0.1m), Ni (0.4m), Ag (0.6m)
Die Bond
Store in original container, in dry Nitrogen,
0.51mm min (black, center)
Electrically conductive epoxy or solder
<6 months at an ambient temperature of 23°C
Chip Type
VCE
ICn
Die Size
Package
AUIRG7CH80K6B
1200V
200A
12 X 12 mm2
Wafer
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