参数资料
型号: AUIRLR024NTRL
厂商: International Rectifier
文件页数: 1/13页
文件大小: 0K
描述: MOSFET N-CH 55V 17A DPAK
标准包装: 3,000
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 17A
开态Rds(最大)@ Id, Vgs @ 25° C: 65 毫欧 @ 10A,10V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 5V
输入电容 (Ciss) @ Vds: 480pF @ 25V
功率 - 最大: 45W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
PD- 96348
Features
Advanced Planar Technology
Low On-Resistance
AUTOMOTIVE GRADE
AUIRLR024N
AUIRLU024N
HEXFET ? Power MOSFET
Logic-Level Gate Drive
Dynamic dV/dT Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Repetitive Avalanche Allowed up to Tjmax
G
D
S
V (BR)DSS
R DS(on) max.
I D
55V
0.065 ?
17A
Lead-Free, RoHS Compliant
Automotive Qualified *
Description
Specifically designed for Automotive applications, this
Cellular design of HEXFET? Power MOSFETs utilizes
the latest processing techniques to achieve low on-
resistance per silicon area. This benefit combined with
the fast switching speed and ruggedized device design
that HEXFET power MOSFETs are well known for,
D
S
D
G
D-Pak
AUIRLR024N
D
S
D
G
I-Pak
AUIRLU024N
provides the designer with an extremely efficient and
reliable device for use in Automotive and a wide variety of
other applications.
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated
in the specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect
device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still
air conditions. Ambient temperature (T A ) is 25°C, unless otherwise specified.
Parameter
Max.
Units
I D @ T C = 25°C
Continuous Drain Current, V GS @ 10V
17
I D @ T C = 100°C
I DM
P D @T C = 25°C
V GS
E AS
I AR
E AR
dv/dt
Continuous Drain Current, V GS @ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
12
72
45
0.3
± 16
68
11
4.5
5.0
A
W
W/°C
V
mJ
A
mJ
V/ns
T J
T STG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
-55 to + 175
300 (1.6mm from case )
°C
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
Junction-to-Case
–––
3.3
R θ JA
R θ JA
Junction-to-Ambient (PCB mount) **
Junction-to-Ambient
–––
–––
50
110
°C/W
HEXFET ? is a registered trademark of International Rectifier.
* Qualification standards can be found at http://www.irf.com/
www.irf.com
1
01/18/11
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