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参数资料
| 型号： | AUM005A0D-SRZ |
| 厂商： | LINEAGE POWER LLC |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 10 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT, SMT-4 |
| 文件页数： | 10/26页 |
| 文件大小： | 1248K |
| 代理商： | AUM005A0D-SRZ |
Lineage
Power
18
Data Sheet
March 25, 2008
3.0 Vdc - 5.5 Vdc Input, 1.5 Vdc - 3.3 Vdc Output, 6 A
Austin Series SMT Non-Isolated dc-dc Power Modules:
Surface Mount Information
Pick and Place Area
Although the module weight is minimized by using open-
frame construction, the modules have a relatively large
mass compared to conventional surface-mount components.
To optimize the pick-and-place process, automated vacuum
equipment variables such as nozzle size, tip style, vacuum
pressure, and placement speed should be considered. The
Product ID label si to be utilised for vacuum pick up of the
Austin Power Module.
Tin Lead Soldering
The Austin Series SMT power modules are lead free mod-
ules and can be soldered either in a lead-free solder process
or in a conventional Tin/Lead (Sn/Pb) process. It is recom-
mended that the customer review data sheets in order to
customize the solder reflow profile for each application
board assembly. The following instructions must be
observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause dam-
age to the modules, and can adversely affect long-term reli-
ability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235oC. Typi-
cally, the eutectic solder melts at 183oC, wets the land, and
subsequently wicks the device connection. Sufficient time
must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably sol-
dered using natural forced convection, IR (radiant infrared),
or a combination of convection/IR.
Figure 61. Reflow Profile.
An example of a reflow profile (using 63/37 solder) for the
Austin Lynx SMT Power Module is:
n
Pre-heating zone: room temperature to 183 °C (2.0 to 4.0
minutes maximum)
n
Initial ramp rate: < 2.5 °C per second
n
Soaking zone: 155 °C to 183 °C – 60 to 90 seconds typical
(2.0 minutes maximum)
n
Reflow zone ramp rate: 1.3 °C to 1.6 °C per second
n
Reflow zone: 210 °C to 235 °C peak temperature – 30 to 60
seconds typical (90 seconds maximum)
Lead Free Soldering
The –Z version Austin Series SMT modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering pro-
cess. Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Mois-
ture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices) for both Pb-free solder pro-
files and MSL classification procedures. This standard pro-
vides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-
2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using Sn/Ag/Cu sol-
der is shown in Figure. 62.
MSL Rating
The Austin Series SMT modules have a MSL rating of 1.
Storage and Handling
The recommended storage environment and handling pro-
cedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These sealed pack-
ages should not be broken until time of use. Once the origi-
nal package is broken, the floor life of the product at
conditions of 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf
life for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assem-
bly process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished cir-
cuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to
Lineage Power
Board Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
TIME (SECONDS)
ALLOY: Sn63Pb37 or Sn62Pb36Ag02
REFLOW PROFILE
TEMPERA
TURE
(C)
0
20
40
60
80
100
120
140
160
180
200
220
30
60
90
120
150
180
210
240
270
0
REFLOW ZONE
30 - 90 SEC MAX
30 - 60 SEC
2.0 MIN MAX
60 - 90 SEC
SOAKING ZONE
<2.5 C/SEC
0.5 - 0.6 C/SEC
1.3 - 1.6 C/SEC
PEAK TEMP.
210 - 235 C
2.0 - 4.0 MIN
PRE-HEATING
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