参数资料
型号: AW24MUFL-H2
厂商: Artaflex Inc
文件页数: 22/23页
文件大小: 0K
描述: 2.4GHZ WIRELESS MODULE U.FL
标准包装: 50
频率: 2.4GHz
数据传输率 - 最大: 1Mbps
调制或协议: DSSS,GFSK
应用: AMR,ISM,RKE
功率 - 输出: 4dBm
灵敏度: -97dBm
电源电压: 2.4 V ~ 3.6 V
电流 - 接收: 21.2mA
电流 - 传输: 34.1mA
数据接口: 连接器,2 x 6 接头,2mm 间距
天线连接器: U.FL
工作温度: 0°C ~ 70°C
封装/外壳: PCB 模块
其它名称: 748-1006
AW24MCHL-UFL
k. Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not
require cleaning after the soldering process.
Note: The quality of the solder joints on the castellations (‘half vias’) where they
contact the host board should meet the appropriate IPC specification. See IPC-
A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated
Terminations .
l. Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals
under the module cannot be easily removed with any cleaning process.
Cleaning with water can lead to capillary effects where water is absorbed into
the gap between the host board and the module. The combination of soldering
flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux
residuals into the two housings, which is not accessible for post-washing
inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and
eliminate the post-soldering cleaning step.
m. Optical Inspection
After soldering the Module to the host board, consider optical inspection to
check the following:
Proper alignment and centering of the module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring pads, or vias.
Artaflex Inc.
215 Konrad Crescent
Markham, Ontario, Canada
L3R8T9
(905) 479-0148
Page 22 of 23
File: AN-121-0001-R2
http://www.artaflexmodules.com
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