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参数资料
| 型号： | AXA005A0X-SRZ |
| 厂商： | LINEAGE POWER LLC |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT DC-DC REG PWR SUPPLY MODULE |
| 封装： | ROHS COMPLIANT, SMT-5 |
| 文件页数： | 13/21页 |
| 文件大小： | 578K |
| 代理商： | AXA005A0X-SRZ |
Data Sheet
October 1, 2009
Austin MicroLynxTM 12V SMT Non-isolated Power Modules:
10 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 5A output current
LINEAGE POWER
20
Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MicroLynx 12V SMT modules
are lead-free (Pb-free) and RoHS compliant and are
both forward and backward compatible in a Pb-free
and a SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 36.
MSL Rating
The Austin MicroLynx 12V SMT modules have a MSL
rating of 2..
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning
Application Note
(AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
ow
T
em
p
(°
C
)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 36. Recommended linear reflow profile
using Sn/Ag/Cu solder.
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