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参数资料
| 型号： | AXA2R73321P |
| 厂商： | Panasonic Electric Works |
| 文件页数： | 7/8页 |
| 文件大小： | 0K |
| 描述： | CONN SD MEMORY CARD TYPE R SMD |
| 标准包装： | 350 |
| 系列： | AXA2R |
| 卡类型： | 安全数字式 - SD |
| 位置数： | 12（9 + 3） |
| 连接器类型： | 连接器和弹出器 |
| 插入，移除方法： | 推入式，推出式 |
| 安装类型： | 表面贴装，直角 |
| 特点： | 板导轨，开关 |
| 板上方高度： | 0.193"（4.90mm） |
| 安装特点： | 反向 - 底部 |
| 包装： | 带卷 (TR) |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 闪光 |
To be transferred to Honda Tsushin kogyo Co.,Ltd. from October 1, 2009
EMBOSSED TAPE AND REEL (Unit: mm)
AXA2R
? Tape dimensions
Socket for SD memory card
? Reel dimensions (Conforming to JIS C0806-1995)
Emboss
carrier tape
Top cover
tape
(44.4) +20
Taping reel
Top cover tape
Tape
Emboss carrier tape
Cavity
5 ±
.05
20.20
1.5
0
(1.75)
dia
.
Label
40.40
44.00
NOTES
1.Regarding the design of PC board
patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When re?ow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
con?rm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
3. Soldering
1) Re?ow soldering
(1) Screen-printing method is
recommended for cream solder printing.
(2) Use the recommended foot pattern for
cream solder printing (screen thickness:
0.12 mm).
(3) The metal mask opening ratio for the
COM contact (one) and NO contacts
(two) must be 75%.
(4) When applying the different thickness
of a screen, please consult us.
(5) The following diagram shows the
recommended re?ow soldering
temperature pro?le.
The recommended conditions for the
re?ow temperature pro?le
(6) Measure the temperature at the
connector surface.
(7) If the reverse side of the board
undergoes re?ow soldering after the
socket is re?ow-soldered, ?x the socket
with tape or adhesive; otherwise, the
socket may drop. The socket can
withstand two iterations of re?ow
soldering.
2) Hand soldering
? Set the soldering tip to 300°C, and
solder for no more than 5 seconds.
? Be aware that for the 0 mm standoff
type, solder creeping at the retention
solder tab sections may occur if soldering
is conducted for long periods or if too
much solder is used.
4. Cleaning after soldering
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as ?ux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PC board and soldered terminals is
possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PC boards or
storing them in block assemblies, make
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
3) Repeated bending of the terminals
may break them.
7. Card ?tting
1) These products are made for the
design of compact and lightweight
devices and therefore the molded part is
very thin. For this reason, design the
device to prevent undue wrenching forces
from being applied to the product during
use.
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
3) When not soldered, be careful not to
insert and remove the socket’s card.
Doing so will cause a decrease in
anchoring ability of the molded part and
loss of coplanarity.
4) Forcibly removing a ?tted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the slider lock before pulling out
the card.
5) Please include notes to the following
effect in your user manuals.
6) The card ejection protection lock does
not work for MMC.
Temperature
250 ° C max.
155 to 165 ° C
Peak temperature
180 to 200 ° C
Preheating
sure that undue weight is not exerted on
a stacked socket.
3) Be sure not to allow external pressure
to act on sockets when assembling PC
7) The socket does not have a wrong
insertion protection structure for MMC.
Be careful about the insertion direction.
8) If an MMC is inserted, it is possible
60 to 120 sec.
Within 30 sec.
Time
boards or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
that a short circuit between the socket’s
signal contacts No. 7 and 8 and the
MMC’s contact No. 7 may be caused.
fall from work bench
panasonic-electric-works.net/ac
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AXA2R73321P-M | 制造商:Panasonic Electric Works 功能描述: |
| AXA2R73321T | 功能描述:记忆卡连接器 Conn SD Card HDR 9 POS Solder 0.5A RoHS:否 制造商:Yamaichi Electronics 产品:Card Connectors 卡类型:microSD 类型: 节距: 方向: 安装风格:SMD/SMT 端接类型: 排数: 触点数量: 电流额定值:0.5 A 电压额定值:50 V |
| AXA2R73361 | 制造商:PANASONIC 制造商全称:Panasonic Semiconductor 功能描述:Enhanced robustness and EMI resistance achieved by the laser-welded double-sided metal shell |
| AXA2R73361P | 功能描述:记忆卡连接器 CONN SD MEMORY CARD 9 POS Solder 0.5A RoHS:否 制造商:Yamaichi Electronics 产品:Card Connectors 卡类型:microSD 类型: 节距: 方向: 安装风格:SMD/SMT 端接类型: 排数: 触点数量: 电流额定值:0.5 A 电压额定值:50 V |
| AXA2R73361P-M | 制造商:Panasonic Electric Works 功能描述:SD CARD SOCKET NORMAL TYPE 1.58MM STAND |
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