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参数资料
| 型号： | AXC51S4150 |
| 厂商： | Panasonic Electric Works |
| 文件页数： | 9/10页 |
| 文件大小： | 0K |
| 描述： | CONN MICRO COAXIAL RECT 41 POS |
| 标准包装： | 1,000 |
| 系列： | CS |
| 连接器类型： | 插座 |
| 触点类型：： | 外罩触点 |
| 位置数： | 41 |
| 加载位置的数目： | 全部 |
| 间距： | 0.020"（0.50mm） |
| 行数： | 1 |
| 安装类型： | 表面贴装 |
| 端子： | 焊接 |
| 特点： | 固定焊尾 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 3.9µin（0.10µm） |
| 颜色： | 黑 |
| 包装： | 带卷 (TR) |
| 配套产品： | AXC61S4174-ND - CONN MICRO COAXIAL PLUG 41POS CS |
Notes on Using Micro Coaxial Connectors
? Plug
21, 41 pin contacts (#38 wire for power supply)
Recommended cable pattern
? Plug
Recommended cable pattern
A ± 0.1
A ± 0.1
0.50 ± 0.05
C ± 0.1
0.25 ± 0.05
#44
(fine diameter)
or #46
#38 (Each of
the two ends)
0.35 ± 0.03
0.40 ± 0.05
Y
0.31 ± 0.03
Z
B
View Y
B
View Z
Dimension table (mm)
Dimension table (mm)
Number of pins/dimension
A
B
Number of pins/dimension
A
B
C
40
15.60
16.60
21
41
4.75
9.75
6.00
11.00
3.00
8.00
2) Re?ow soldering
? Screen-printing is recommended for printing paste solder.
41 pin contacts/51 pin contacts (signal wire only)
Recommended cable pattern
? To determine the relationship between the screen opening area
and the PC board foot pattern area, refer to the diagrams in the
0.25 ± 0.05
A ± 0.1
Z'
C ± 0.03
recommended patterns for PC boards and metal masks.
Make sure to use the terminal tip as a reference position when
setting.
? Too much solder may cause solder creeping near the
contacting part or a short circuit with the shell (GND).
Dimension table (mm)
B
View Z'
Terminal
Paste
solder
PC board
foot pattern
Number of pins/dimension
A
B
C
41
51
10.00
12.50
11.00
13.50
0.34
0.31
? Consult us when using a screen-printing thickness other than
that recommended.
? Depending on the size of the connector being used, self
CF series
? Receptacle
Recommended PC board pattern (mounting pad layout)
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
? The recommended re?ow temperature pro?le is given in the
?gure below
A ± 0.05
B ± 0.05
0.40 ± 0.03
0.23 ± 0.03
Insulation
Temperature
260 ° C
230 ° C
180 ° C
150 ° C
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Peak temperature
220 ° C
Preheating 200 ° C
25 sec.
Insulation
0.90 ± 0.03
Insulation
GND connection
(4 places)
60 to 120 sec.
70 sec.
Time
? The temperature is measured on the surface of the PC board
Recommended window size of metal mask
Metal mask thickness: When 120 μ m
(Signal terminal portion opening area ratio: 70%)
(GND terminal portion opening area ratio: 80%)
near the connector terminal.
? Certain solder and ?ux types may cause serious solder
creeping.
Solder and ?ux characteristics should be taken into
consideration when setting the re?ow soldering conditions.
0.40 ± 0.03
0.21 ± 0.02
B ± 0.05
? Do not apply adhesive to secure the connector, because it can
affect the spring action of the contact.
? When coating the PC board after soldering the connector to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the connector.
3) Reworking on a soldered portion
Dimension table (mm)
C ± 0.03
D ± 0.03
? Finish reworking in one operation.
? For reworking of the solder bridge, use a soldering iron with a
?at tip. Do not add ?ux, otherwise, the ?ux may creep to the
contact parts.
Number of pins/dimension
40
A
19.10
B
15.60
C
18.20
D
20.00
? Use a soldering iron whose tip temperature is within the
temperature range speci?ed in the speci?cations.
Panasonic Corporation Automation Controls Buisiness Division
industrial.panasonic.com/ac/e/
– 9 –
? Panasonic Corporation 2013
ACCTB12E 201303-T
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