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| 型号： | AXE100224 |
| 厂商： | Panasonic Electric Works |
| 文件页数： | 5/9页 |
| 文件大小： | 0K |
| 描述： | CONN SOCKET 100POS 1.0/1.5MM H |
| 其它有关文件： | Connectors SMD-Technical Info |
| 产品培训模块： | Tough Contact Connectors |
| 标准包装： | 1,000 |
| 系列： | A4US |
| 连接器类型： | 插口，中央触点带 |
| 位置数： | 100 |
| 间距： | 0.016"（0.40mm） |
| 行数： | 2 |
| 安装类型： | 表面贴装 |
| 特点： | 固定焊尾 |
| 触点表面涂层： | 金 |
| 包装： | 带卷 (TR) |
| 配接层叠高度： | 1mm，1.5mm |
| 板上方高度： | 0.038"（0.97mm） |
| 配套产品： | AXE200224-ND - CONN HEADER 100POS 1.0MM H GOLD AXE200324-ND - CONN HEADER 100POS 1.5MM H GOLD |
AXE1/AXE2
EMBOSSED TAPE DIMENSIONS (Unit: mm)
? Speci?cations for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
? Speci?cations for the plastic reel
(In accordance with EIAJ ET-7200B.)
Tape I
Tape II
? 0.1
(A + 0.3 )
(C)
(1.75)
(A ± 0.3)
(B)
(C)
(1.75)
(D ± 1)
Label
Top cover tape
Embossed carrier tape
Embossed mounting-hole
Taping reel
+0
+0
1.
5
0 .1
di
a.
1.
5
0 .1
di
a.
? Dimension table (Unit: mm)
Type/Mated height
Common for sockets and headers:
0.8mm, 1.0mm and 1.5mm
Number of pins
Max. 24
30 to 60
70, 80
Type of taping
Tape I
Tape I
Tape II
A
16.00
24.00
32.00
B
—
—
28.40
C
7.50
11.50
14.20
D
17.40
25.40
33.40
Quantity per reel
10,000
10,000
10,000
? Connector orientation with respect to embossed tape feeding direction
Type
Direction
of tape progress
Socket
Common for A4US
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
? Socket (Mated height: 0.8 mm, 1.0
mm and 1.5 mm)
Recommended PC board pattern (TOP VIEW)
0.40 ± 0.03
0.23 ± 0.03
? Header (Mated height: 0.8 mm, 1.0
mm and 1.5 mm)
Recommended PC board pattern (TOP VIEW)
0.40 ± 0.03
0.23 ± 0.03
0.5 mm.
In order to reduce solder and ?ux rise,
solder bridges and other issues make
0.80 ± 0.03
1.45 ± 0.03
: Insulatin area
0.28 ± 0.03
0.80 ± 0.03
sure the proper levels of solder is used.
The ?gures to the right are recommended
metal mask patterns. Please use them as
a reference.
3. See the common “NOTES FOR
USE” on the next page for other points
Recommended metal mask pattern
Metal mask thickness: When 120 μ m
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 100%)
0.40 ± 0.01
0.20 ± 0.01
Recommended metal mask pattern
Metal mask thickness: When 120 μ m
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 73%)
0.40 ± 0.01
0.20 ± 0.01
to be noted.
0.80 ± 0.01
1.45 ± 0.01
0.23 ± 0.01
0.80 ± 0.01
Please refer to the latest product
speci?cations when designing your
product.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB4E 201303-T
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