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参数资料
| 型号： | AXE454124 |
| 元件分类： | SMT连接器& FFC/FPC |
| 英文描述： | 54 CONTACT(S), MALE, STRAIGHT FFC/FPC CONNECTOR, SURFACE MOUNT |
| 封装： | ROHS COMPLIANT |
| 文件页数： | 6/6页 |
| 文件大小： | 408K |
| 代理商： | AXE454124 |
Information
NOTES FOR USING ADVANCED SERIES
NARROW-PITCH CONNECTORS (Common)
Connector mounting
In case the connector is picked up by
chucking during mounting, an excessive
mounter chucking force may deform the
molded or metal part of the connector.
Consult us in advance if chucking is to be
applied.
Soldering
1) Manual soldering.
Due to the low prole, if an excessive
amount of solder is applied to this
product during manual soldering, the
solder may creep up to near the contact
points, or interference by solder may
cause imperfect contact.
Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specications.
Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any ux before use.
Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
Thoroughly clean the iron tip.
2) Reow soldering
Screen-printing is recommended for
printing paste solder.
To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting.
Avoid an excessive amount of solder
from being applied, otherwise,
interference by the solder will cause an
imperfect contact.
Consult us when using a screen-printing
thickness other than that recommended.
Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
The recommended reow temperature
prole is given in the gure below
Recommended reow temperature prole
The temperature is measured on the
surface of the PC board near the
connector terminal.
Some solder and ux types may cause
serious solder creeping. Take the solder
and ux characteristics into consideration
when setting the reow soldering
conditions.
When performing reow soldering on
the back of the PC board after reow
soldering the connector, secure the
connector using, for example, an
adhesive (Double reow soldering on the
same side is possible)
3) Reworking on a soldered portion
Finish reworking in one operation.
For reworking of the solder bridge, use
a soldering iron with a at tip. Do not add
ux, otherwise, the ux may creep to the
contact parts.
Use a soldering iron whose tip
temperature is within the temperature
range specied in the specications.
Do not drop the product or handle it
carelessly. Otherwise, the terminals
may become deformed due to
excessive force or the solderability
during reow soldering may degrade.
Do not insert or remove the
connector when it is not soldered.
Also, forcibly applied external
pressure on the terminals can weaken
the adherence of the terminals to the
molded part or cause the terminals to
lose their evenness.
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive forces.
Notes when using a FPC.
When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Make sure
that the reinforcing plate is larger than the
outline of the recommended PC board
pattern (Outline + approx. 1 mm). The
reinforcing plate is made of SUS, glass
epoxy or polyimide that is 0.2 to 0.3 mm
thick.
This connector employs a simple locking
structure. However, the connector may
come off depending on the size and
weight of the FPC, layout and reaction
force of FPC, or by drop impact. Make
sure to fully check the equipment’s
condition. To prevent any problem with
loose connectors, adopt measures to
prevent the connector from coming off
inside the equipment.
Other Notes
When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
Terminal
Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Time
Temperature
Peak temperature
200
°C
220
°C
Upper limit (Soldering heat resistance)
260
°C
230
°C
180
°C
150
°C
70 sec.
25 sec.
Lower limit (Solder wettability)
For other details, please verify with
the product specication sheets.
Do not the soldered areas to be subjected to forces
panasonic-electric-works.net/ac
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