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参数资料
| 型号： | AXK830225WG |
| 厂商： | Panasonic Electric Works |
| 文件页数： | 5/15页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER FPC .4MM 30POS SMD |
| 其它有关文件： | Connectors SMD-Technical Info |
| 标准包装： | 1,000 |
| 系列： | P4 |
| 连接器类型： | 接头，外罩触点 |
| 位置数： | 30 |
| 间距： | 0.016"（0.40mm） |
| 行数： | 2 |
| 安装类型： | 表面贴装 |
| 特点： | 固定焊尾 |
| 触点表面涂层： | 金 |
| 包装： | 带卷 (TR) |
| 配接层叠高度： | 3.5mm |
| 板上方高度： | 0.089"（2.26mm） |
| 配套产品： | AXK730447G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730427G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730347G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730337G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730237G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730147G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730137G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730117G-ND - CONN SOCKET BRD/BRD .4MM 30POS AXK730247G-ND - CONN SOCKET FPC .4MM 30POS SMD |
AXK7, 8
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Speci?cations
0.3A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
Conditions
Electrical
characteristics
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
150V AC for 1 min.
Min. 1,000M ? (initial)
Max. 70m ?
Max. 0.981N/pin contacts × pin contacts (initial)
Detection current: 1mA
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
speci?ed by JIS C 5402.
Min. 0.0588N/pin contacts × pin contacts
Mechanical
characteristics
Composite removal force
(Mated height 1.5 mm without soldering terminals type)
Min. 0.118N/pin contacts × pin contacts
All the other types except the above
(Mated height 1.5 mm without soldering terminals type)
Post holding force
Ambient temperature
Soldering heat resistance
Storage temperature
Min. 0.981N/pin contacts
–55 ° C to +85 ° C
Max. peak temperature of 260 ° C (on the surface of the
PC board around the connector terminals)
300 ° C within 5 sec. 350 ° C within 3 sec.
–55 ° C to +85 ° C (product only)
–40 ° C to +50 ° C (emboss packing)
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
Infrared re?ow soldering
Soldering iron
No freezing at low temperatures.
No dew condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature ( ° C)
Time (minutes)
Environmental
characteristics
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100M ? ,
contact resistance max. 70m ?
1
2
3
4
–55 ? 0 3
85 + 30
30
Max. 5
30
Max. 5
–55 ? 0 3
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H 2 S resistance
(header and socket mated)
120 hours,
insulation resistance min. 100M ? ,
contact resistance max. 70m ?
24 hours,
insulation resistance min. 100M ? ,
contact resistance max. 70m ?
48 hours,
contact resistance max. 70m ?
Bath temperature 40 ± 2 ° C,
humidity 90 to 95% R.H.
Bath temperature 35 ± 2 ° C,
saltwater concentration 5 ± 1%
Bath temperature 40 ± 2 ° C,
gas concentration 3 ± 1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics
Unit weight
Insertion and removal life
50 times
Mated height 1.5mm, 20 pin contacts;
Socket: 0.04g Header: 0.02g
Repeated insertion and removal speed of max. 200
times/hours
2. Material and surface treatment
Part name
Molded portion
Contact and Post
Soldering terminals portion
Material
LCP resin (UL94V-0)
Copper alloy
Copper alloy
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
However, upper terminal of Ni barrier production: Exposed over Ni
The area adjacent to the terminal of the sockets on models with Ni barrier is exposed to Ni on base.
Ni plating on base, Sn plating on surface (Except for front terminal)
ACCTB57E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
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