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参数资料
| 型号： | AXS632339S |
| 元件分类： | 插座 |
| 英文描述： | SOP32, IC SOCKET |
| 文件页数： | 1/7页 |
| 文件大小： | 936K |
| 代理商： | AXS632339S |
AXS6
169
SOP IC
SOCKETS
(AXS6)
SOCKET SERIES
IC SOCKETS FOR
SMALL OUTLINE
PACKAGE
FEATURES
1. Requires no pattern changes when
directly mounting an IC
The foot patterns of SO package IC chips
and of the socket are identical. Thus, the
sockets can be used from prototyping to
initial production, and during actual
production the IC chips can be directly
mounted to the PC board without any
changes to the PC board patterns.
2. Achieves a mounting height of 5mm
or less including the IC’s height
The maximum height is 5mm, even when
taking into consideration the rise in
cream solder and the IC’s maximum
height. Ideal for low-prole requirements.
Socket height: 4.5mm (28, 32 and 40
contact)
Socket height: 4.2mm (8, 20 and 24
contact)
3. Space saving
The socket occupies an area only 1.25
times the size of the IC. High density
mounting is possible even if the socket is
used.
4. Automated mounting compatible
The socket has an open at construction
on its top surface so that it can be picked
up by an automated mounting machine
using suction for automated mounting.
APPLICATIONS
1. For initial production (prototyping to
initial production stages, which use
sockets for fast production of a new
product)
2. For functional upgrades (situations
requiring ROM replacement or LSI chip
replacement)
Socket frame
SO package IC chip
Socket body
VENDOR-CLASSIFIED COMPATIBILITY LIST FOR SOP IC SOCKETS
Please consult us for compatibility with other IC models.
Notes) 1. The centering frame is used to secure ICs which are too small to be secured with the standard frame. The centering frame has inward
projections in the center portion. For easy identication, the centering frame is a sky gray color, whereas the standard frame is a creamy gray
color.
2. The contents of this compatibility list are valid as of July, 2002.
No. of
contacts
Nominal dimensions
Applicable Ics (IC maker: Part No.)
8
300 mil
FUJITSU: FPT-8P-M01
TI: PS008
14
300 mil
NEC: P14GM-50-300B-2
MITSUBISHI: 14P2W
TOSHIBA: SOP14-P-300
TI: PS014
HITACHI: FP-14D, FP-14DA
FUJITSU: FPT-14P-M04
MOTOROLA: 751A-02
20
300 mil
NEC: P20GM-50-300B, P20GM-50-300C-2
MEC: SONF-20D
HITACHI: FP-20DA, FP-20DN
375 mil
NEC: P20GM-50-375B-3, P20GT-50-375B-2
MOTOROLA: 751D-03
FUJITSU: FPT-20P-M02
ATMEL: 20S
24
300 mil
NEC: P24GM-50-300B-2
28
375 mil
NEC: P28GM-50-375B-2, P28GT-50-375B-2
MITSUBISHI: 28P2V-A
FUJITSU: FPT-28P-M01
MOTOROLA: 751F-02
450 mil
Standard frame
TOSHIBA: SOP28-P-450
OKI IC: SOP28-P-430-K
ATMEL: 28R
Centering frame
NEC: P28GM-50-450A1-2, P28GM-50-450A2-2
HITACHI: FP-28D, FP-28DA
MITSUBISHI: 28P2W-A, 28P2W-C
MEC: SOP028-P-0425
SHARP: SOP28-P-450
32
450 mil
FUJITSU: FPT-32P-M02
TOSHIBA: SOP32-P-450
525 mil
NEC: S32GM-50-525A-2
MITSUBISHI: 32P2M-A
TOSHIBA: SOP32-P-525
MACRONIX: MX27C1000MC-90
HITACHI: FP-32D
FUJITSU: FPT-32P-M03
SANYO: 3205
40
525 mil
HITACHI: FP-40D
MITSUBISHI: 40P2M-A
44
600 mil
NEC: P44GX-50-600A
INTEL: 231369-80
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AXS-7050-04-01 | 功能描述:SOCKET 4PAD 7.0X5.0 XTAL OR OSC RoHS:是 类别:晶体和振荡器 >> 插口和绝缘体 系列:- 产品目录绘图:CI-148-028-3 (SR) 标准包装:100 系列:- 类型:绝缘体 适用于相关产品:晶体 位置数:3 设备尺寸:HC-80/U 其它名称:492-1038CI-148-028-3 SR |
| AXS-7050-04-02 | 功能描述:SOCKET 4PAD 7.0X5.0 XTAL OR OSC RoHS:是 类别:晶体和振荡器 >> 插口和绝缘体 系列:- 产品目录绘图:CI-148-028-3 (SR) 标准包装:100 系列:- 类型:绝缘体 适用于相关产品:晶体 位置数:3 设备尺寸:HC-80/U 其它名称:492-1038CI-148-028-3 SR |
| AXS-7050-04-12 | 功能描述:SOCKET 4PAD 7.0X5.0 XTAL OR OSC RoHS:是 类别:晶体和振荡器 >> 插口和绝缘体 系列:- 产品目录绘图:CI-148-028-3 (SR) 标准包装:100 系列:- 类型:绝缘体 适用于相关产品:晶体 位置数:3 设备尺寸:HC-80/U 其它名称:492-1038CI-148-028-3 SR |
| AXS-7050-04-17 | 功能描述:测试插座 7.0 x 5.0 x 1.15 Osc 4 pad test socket RoHS:否 制造商:Deltron |
| AXS-7050-06-07 | 功能描述:SOCKET 6PAD 7.0X5.0 OSCILLATOR RoHS:是 类别:晶体和振荡器 >> 插口和绝缘体 系列:- 产品目录绘图:CI-148-028-3 (SR) 标准包装:100 系列:- 类型:绝缘体 适用于相关产品:晶体 位置数:3 设备尺寸:HC-80/U 其它名称:492-1038CI-148-028-3 SR |
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