参数资料
型号: AYF532365
厂商: Panasonic Electric Works
文件页数: 6/8页
文件大小: 0K
描述: CONN SOCKET FPC 0.5MM 23POS SMD
标准包装: 1,000
系列: Y5BW
连接器类型: 顶部和底部触点
位置数: 23
间距: 0.020"(0.50mm)
FFC,FCB 厚度: 0.30mm
板上方高度: 0.039"(1.00mm)
安装类型: 表面贴装,直角
线缆端类型: 槽口式或通孔式
端子: 焊接
锁定功能: 翻转锁定,背锁
包装: 带卷 (TR)
触点表面涂层:
触点涂层厚度: 闪光
工作温度: -55°C ~ 85°C
额定电流: 0.200A(每触点)
额定电压: 50V
体座材料: 液晶聚合物(LCP)
Notes on Using FPC Connectors
■ PC board design
Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas of the terminal.
? The recommended re?ow temperature pro?le is given in the
?gure below.
Upper limit (Soldering heat resistance)
■ FPC and equipment design
? Design the FPC based with recommended dimensions to
ensure the required connector performance.
? When using back lock type, secure enough space for closing
the lever and for open-close operation of the lever.
? Make sure that connector positioning and FPC length are
appropriate to prevent diagonal insertion of the FPC.
Due to the FPC size, weight, or the reaction force of the routed
Temperature
260 ° C
230 ° C
180 ° C
150 ° C
Lower limit (Solder wettability)
Peak temperature
220 ° C
Preheating 200 ° C
25 sec.
60 to 120 sec. 70 sec.
Time
FPC, FPC may be removed. Carefully check the equipment
design.
Take required measures to prevent the FPC from being removed
due to a fall, vibration, or other impact.
(Y3BW/Y5BW)
■ The holding contacts cannot be used as conductors.
The holding contacts are located on both ends of the contacts,
and the shape of the soldered portions is the same as that of the
other contacts.
Use caution to ensure connect identi?cation.
(Y3BL)
■ Soldering terminal structure
Since soldering terminals touch FPC, note that the short circuit
may occur when the metal parts exposed on side of FPC.
■ Connector mounting
Excessive mounter chucking force may deform the molded or
metal part of the connector. Consult us in advance if chucking is
to be applied.
■ Soldering
1) Manual soldering
? Due to the connector’s compact size, if an excessive amount of
solder is applied during manual soldering, the solder may creep
up and ?ux wicking near the contact points, or solder
interference may cause contact failure.
? Make sure that the soldering iron tip is heated within the
temperature and time limits indicated in the speci?cations.
? Flux from the solder wire may adhere to the contact surfaces
during soldering operations. After soldering, carefully check the
contact surfaces and cleans off any ?ux solder use.
? Be aware that a load applied to the connector terminals while
soldering may displace the contact.
? Thoroughly clean the iron tip.
2) Re?ow soldering
? Screen-printing is recommended for printing paste solder.
? To achieve the appropriate soldering state, make sure that the
re?ow temperature, PC board foot pattern, window size and
thickness of metal mask are recommended condition.
? Note that excess solder on the terminals prevents complete
insertion of the FPC, and causes ?ux climbing up.
? A screen thickness of 120 μ m is recommended during cream
solder printing.
? Consult us when using a screen-printing thickness other than
that recommended.
? Depending on the size of the connector being used, self
alignment may not be possible. Accordingly, carefully position
the terminal with the PC board pattern.
? The temperature is measured on the surface of the PC board
near the connector terminals.
? Depending on re?ow condition, poor contact may occur by
solder and ?ux wicking.
Please set the re?ow conditions that considering the
characteristics of solder and ?ux. Also please make
consideration in setting the re?ow times and O 2 concentration to
prevent poor contact by solder and ?ux wicking.
? When performing re?ow soldering on the back of the PC board
after re?ow soldering the connector, secure the connector using,
for example, an adhesive.
(Double re?ow soldering on the same side is possible.)
Do not touch the lever or apply any load to the lever until the
second re?ow soldering. Otherwise, contact de?ection occurs
and the terminals may be deformed by re?ow heating.
3) Reworking on a soldered portion
? Finish reworking in one operation.
? For reworking of the solder bridge, use a soldering iron with a
?at tip.
Do not add ?ux, otherwise the ?ux may creep to the contact
parts.
When adding the solder for reworking, do not add an excessive
solder. Otherwise, solder and ?ux may creep up and solder
bridges may occur.
? Use a soldering iron whose tip temperature is within the
temperature range speci?ed in the speci?cations.
■ Do not drop or handle the connector carelessly.
Otherwise, the terminals may become deformed due to
excessive force or applied solderability may be during
re?ow degrade.
■ Do not open/close the lever or insert/remove an FPC until
the connector is soldered. Forcibly applied external
pressure on the terminals can weaken the adherence of the
terminals to the molded part or cause the terminals to lose
their evenness. In addition, do not insert an FPC into the
connector before soldering the connector.
■ When cutting or bending the PC board after mounting the
connector, be careful that the soldered sections are
subjected to excessive force.
The soldered areas should not be subjected to force.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB13E 201303-T
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