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参数资料
| 型号： | B048F096T24-EB |
| 厂商： | Vicor Corporation |
| 文件页数： | 9/12页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD 9.6V OUT 240W SMD |
| 产品培训模块： | VI Chip Bus Converter Modules |
| 标准包装： | 1 |
| 系列： | V-I Chip™, BCM™ |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，隔离 |
| 功率 - 输出： | 240W |
| 输出电压： | 9.6V |
| 电流 - 输出： | 25A |
| 输入电压： | 38 ~ 55 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 3.1MHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | B048F096T24 |
| 其它名称： | 1102-1176 B048F096T24-EB-ND |
Not Recommended for New Designs - Replaced by BCM48Bx096y240A00
Configuration Options
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
B048F096T24
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
NOTES:
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. VI CHIP ? MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE VI CHIP PRODUCTS.
TOP SIDE SHOWN
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Figure 19 — Hole location for push pin heat sink relative to VI Chip ? module
BCM ? Bus Converter
Page 9 of 12
Rev 4.9
01/2014
vicorpower.com
800 927.9474
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| B048F120M20 | 制造商:VICOR 制造商全称:Vicor Corporation 功能描述:VI Chip - BCM Bus Converter Module |
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