参数资料
型号: B32022A3333K
厂商: EPCOS Inc
文件页数: 13/21页
文件大小: 0K
描述: FILM CAP 33NF 10% 300VAC MKP Y2
标准包装: 500
系列: B32022
电容: 0.033µF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚丙烯
容差: ±10%
ESR(等效串联电阻): *
工作温度: -40°C ~ 110°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 0.709" L x 0.315" W(18.00mm x 8.00mm)
高度 - 座高(最大): 0.551"(14.00mm)
端子: PC 引脚
引线间隔: 0.591"(15.00mm)
特点: EMI 抑制
应用: *
包装: 散装
其它名称: B32022A3333K000
B32021 ... B32026
Y2 / 300 V AC
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Application note for X1 / X2 EMI capacitors
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 21
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B32022A3333K000 功能描述:薄膜电容器 33NF 10% 300V FILM CAP MKP Y4 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32022A3333K189 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors EMI Suppression Capacitors (MKP)
B32022A3333K289 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors EMI Suppression Capacitors (MKP)
B32022A3333M 功能描述:薄膜电容器 0.033uF 300volts 20% Y2 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32022A3333M000 制造商:EPCOS 功能描述:Cap Film 0.033uF 300VAC PP 20% 18 X 8 X 14mm RDL 15mm Bulk 制造商:EPCOS 功能描述:Cap Film Suppression Y2 0.033uF 300VAC PP 20% (18 X 8 X 14mm) Radial 15mm 110