参数资料
型号: B32362B2607J50
厂商: EPCOS Inc
文件页数: 6/13页
文件大小: 0K
描述: PEC MKP 600 UF 250V
标准包装: 4
系列: B32362
电容: 600µF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚丙烯,金属化
容差: ±5%
ESR(等效串联电阻): *
工作温度: -40°C ~ 70°C
安装类型: 底座安装
封装/外壳: 径向,Can
尺寸/尺寸: 3.346" 直径(85.00mm)
高度 - 座高(最大): 9.724"(247.00mm)
端子: 螺钉端子
引线间隔: 1.378"(35.00mm)
特点: 通用
应用: *
包装: 散装
其它名称: B32362B2607J 50
B32362B2607J050
Film capacitors – Power Electronic Capacitors
General purpose applications
Preliminary data
Specifications and characteristics
B32360 ... B32364
Rated capacitance C R :
Tolerance:
Rated AC Rated AC
3 μF … 600 μF
±5%
Repetitive Non repetitive
V R
voltage
V RMS
250 V
330 V
480 V
voltage
V R
350 V
460 V
680 V
peak voltage
V N
750 V
900 V
1200 V
peak voltage
V s
1125 V
1350 V
1800 V
V RMS
Test data
Voltage between terminals V TT :
Voltage between terminals and aluminum can V TC :
2.15 · V RMS , 2 s
3000 V AC RMS , 2 s
Dissipation factor tan ? at 100 Hz:
Life test:
Life expectancy:
Climatic category:
? stg *:
? min :
? max **:
? hs ***:
Max. permissible humidity:
Max. permissible altitude:
≤ 1.0 · 10 -3
IEC 61071
100000 hours for V RMS | ? C/C| ≤ 3%
40/70/21
–40 °C ... +85 °C
–40 °C
+70 °C
+85 °C
95% (t test = 21 days)
2000 m above sea level
*:
**:
***:
? stg – Storage temperature.
Considering mounting position with terminals to the top. For other mounting position, please request evaluation.
? hs – maximum temperature allowed at the capacitors hot spot.
Mechanical characteristics
Max. torque (case):
Max. torque (terminal):
Construction and general data
M8:
M12:
M6:
M8:
M10:
6 Nm
12 Nm
4 Nm
6 Nm
10 Nm
Resin filling:
Safety device:
Mounting and grounding:
Cooling:
Degree of protection:
Pollution degree:
Reference standards:
UL approval file:
FK PC PEC
Please read Cautions and warnings and
Important notes at the end of this document .
Non PCB, soft polyurethane
Overpressure disconnector, self-healing technology
Stud on bottom of aluminum can
Naturally air-cooled (or forced air cooling)
Indoor mounting
PD4
IEC 1071
E106388 (Pending for B32364 series)
Page 5 of 12
May 2009
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