- 您现在的位置：买卖IC网 > PDF目录18480 > B32521C1154J (EPCOS Inc)CAP FILM 0.15UF 100VDC RADIAL PDF资料下载
参数资料
| 型号： | B32521C1154J |
| 厂商： | EPCOS Inc |
| 文件页数： | 39/45页 |
| 文件大小： | 0K |
| 描述： | CAP FILM 0.15UF 100VDC RADIAL |
| 标准包装： | 4,000 |
| 系列： | B32521 |
| 电容： | 0.15µF |
| 额定电压 - AC： | 63V |
| 额定电压 - DC： | 100V |
| 电介质材料： | 聚酯，金属化 |
| 容差： | ±5% |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 尺寸/尺寸： | 0.512" L x 0.157" W（13.00mm x 4.00mm） |
| 高度 - 座高（最大）： | 0.276"（7.00mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 0.394"（10.00mm） |
| 特点： | 通用 |
| 包装： | 散装 |
| 其它名称： | 495-1152 B32521C1154J000 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页当前第39页第40页第41页第42页第43页第44页第45页
B32520 ... B32529
General purpose (stacked/wound)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Important notes
at the end of this document.
Page 39 of 45
相关PDF资料 |
PDF描述 |
|---|---|
| B32529C8562K289 | FILM CAP 0.0056UF 10% 630V |
| ASG-C-V-B-156.250MHZ-T | OSC 156.250 MHZ 2.5V LVCMOS SMD |
| ASG-C-V-A-156.250MHZ-T | OSC 156.250 MHZ 3.3V LVCMOS SMD |
| ASG-C-V-B-155.520MHZ-T | OSC 155.520 MHZ 2.5V LVCMOS SMD |
| ASG-C-V-A-155.520MHZ-T | OSC 155.520 MHZ 3.3V LVCMOS SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| B32521-C1154-J | 制造商:TDK Epcos 功能描述:CAPACITOR, METALLIZED FILM, POLYESTER, 100 V, 0.15 uF, THROUGH HOLE MOUNT |
| B32521C1154J189 | 功能描述:薄膜电容器 0.15uF 100volts 5% RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32521C1154K | 功能描述:薄膜电容器 0.15uF 100volts 10% RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32521C1154K | 制造商:TDK-EPC 功能描述:CAPACITOR 0.15UF 100V |
| B32521C1154K189 | 功能描述:薄膜电容器 0.15uF 100volt 10% RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
发布紧急采购，3分钟左右您将得到回复。