参数资料
型号: B32524Q8684K189
厂商: EPCOS Inc
文件页数: 39/45页
文件大小: 0K
描述: FILM CAP 0.68UF 10% 630V
标准包装: 350
系列: B32524
电容: 0.68µF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚酯,金属化
容差: ±10%
ESR(等效串联电阻): *
工作温度: -55°C ~ 125°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 1.240" L x 0.433" W(31.50mm x 11.00mm)
高度 - 座高(最大): 0.827"(21.00mm)
端子: PC 引脚
引线间隔: 1.083"(27.50mm)
特点: 通用
应用: *
包装: 带卷 (TR)
B32520 ... B32529
General purpose (stacked/wound)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Important notes
at the end of this document.
Page 39 of 45
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