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参数资料
| 型号： | B32529C103K |
| 厂商： | EPCOS Inc |
| 文件页数： | 39/45页 |
| 文件大小： | 0K |
| 描述： | CAP FILM 10000PF 63VDC RADIAL |
| 产品目录绘图： | MKT Series Side 1 MKT Series Side 2 |
| 标准包装： | 2,000 |
| 系列： | B32529 |
| 电容： | 10000pF |
| 额定电压 - AC： | 40V |
| 额定电压 - DC： | 63V |
| 电介质材料： | 聚酯，金属化 |
| 容差： | ±10% |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 尺寸/尺寸： | 0.287" L x 0.098" W（7.30mm x 2.50mm） |
| 高度 - 座高（最大）： | 0.256"（6.50mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 0.197"（5.00mm） |
| 特点： | 通用 |
| 包装： | 散装 |
| 产品目录页面： | 2063 (CN2011-ZH PDF) |
| 其它名称： | 495-2460 B32529C 103K B32529C0103K000 |
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B32520 ... B32529
General purpose (stacked/wound)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Important notes
at the end of this document.
Page 39 of 45
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相关代理商/技术参数 |
参数描述 |
|---|---|
| B32529C103K | 制造商:TDK-EPC 功能描述:CAPACITOR 10.0NF 63V |
| B32529C103K000 | 功能描述:薄膜电容器 0.01uF 63V 10% RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32529C103K189 | 功能描述:薄膜电容器 0.01uF 63V 10% Tape & Reel RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32529C103K289 | 功能描述:薄膜电容器 0.01uF 63volts 10% RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32529C103K3 | 制造商:TDK Epcos 功能描述: |
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