参数资料
型号: B32537B8684K
厂商: EPCOS Inc
文件页数: 18/24页
文件大小: 0K
描述: FILM CAP 0.68UF 10% 630V
标准包装: 20
系列: B32537
电容: 0.68µF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚酯,金属化
容差: ±10%
ESR(等效串联电阻): *
工作温度: -55°C ~ 125°C
安装类型: 通孔
封装/外壳: 轴向
尺寸/尺寸: 0.500" 直径(12.70mm)
高度 - 座高(最大): 1.339"(34.00mm)
特点: 通用
应用: *
包装: 散装
其它名称: B32537B8684K000
B32537
High reliability (wound)
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 ° C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 20
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