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参数资料
| 型号： | B32559C8103K289 |
| 厂商： | EPCOS Inc |
| 文件页数： | 15/23页 |
| 文件大小： | 0K |
| 描述： | CAP FILM 10000PF 630VDC RADIAL |
| 标准包装： | 2,050 |
| 系列： | B32559 |
| 电容： | 10000pF |
| 额定电压 - AC： | 400V |
| 额定电压 - DC： | 630V |
| 电介质材料： | 聚酯，金属化 |
| 容差： | ±10% |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 尺寸/尺寸： | 0.276" L x 0.157" W（7.00mm x 4.00mm） |
| 高度 - 座高（最大）： | 0.413"（10.50mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 0.197"（5.00mm） |
| 特点： | 通用 |
| 包装： | 带盒（TB） |
| 其它名称： | 495-2907 495-2907-3 495-2907-ND |
B32559C
Compact design (stacked)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 23
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相关代理商/技术参数 |
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|---|---|
| B32559C8152J189 | 制造商:TDK-EPC 功能描述:Cap Film 0.0015uF 630V PET 5% (7 X 3 X 7mm) Radial 5mm 125°C T/R 制造商:EPCOS 功能描述:Cap Film 0.0015uF 630V PET 5% (7 X 3 X 7mm) Radial 5mm 125°C T/R |
| B32559C8152K289 | 功能描述:CAP FILM 1500PF 630VDC RADIAL RoHS:是 类别:电容器 >> 薄膜 系列:B32559 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯，金属化 容差:±3% ESR（等效串联电阻）:- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W（20.70mm x 14.70mm） 高度 - 座高（最大）:1.028"（26.10mm） 端子:PC 引脚 引线间隔:0.394"（10.00mm） 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432 |
| B32559C8222K000 | 功能描述:薄膜电容器 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32559C8272K000 | 功能描述:2700pF Film Capacitor 400V 630V Polyester, Polyethylene Terephthalate (PET) - Stacked Radial 0.276" L x 0.118" W (7.00mm x 3.00mm) 制造商:epcos (tdk) 系列:B32559 包装:散装 零件状态:有效 电容:2700pF 容差:±10% 额定电压 - AC:400V 额定电压 - DC:630V 介电材料:聚酯，聚对苯二甲酸乙二醇酯（PET） - 堆栈型 ESR（等效串联电阻）:- 工作温度:-55°C ~ 125°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:0.276" 长 x 0.118" 宽（7.00mm x 3.00mm） 高度 - 安装（最大值）:0.315"（8.00mm） 端接:PC 引脚 引线间距:0.197"（5.00mm） 应用:高脉冲，DV/DT 特性:- 标准包装:2,000 |
| B32559C8272K289 | 功能描述:CAP FILM 2700PF 630VDC RADIAL RoHS:是 类别:电容器 >> 薄膜 系列:B32559 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯，金属化 容差:±3% ESR（等效串联电阻）:- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W（20.70mm x 14.70mm） 高度 - 座高（最大）:1.028"（26.10mm） 端子:PC 引脚 引线间隔:0.394"（10.00mm） 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432 |
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