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参数资料
| 型号： | B32560J6152K |
| 厂商： | EPCOS Inc |
| 文件页数： | 24/32页 |
| 文件大小： | 0K |
| 描述： | FILM CAP 1.5NF 10% 400V |
| 标准包装： | 1,800 |
| 系列： | B32560 |
| 电容： | 1500pF |
| 额定电压 - AC： | 200V |
| 额定电压 - DC： | 400V |
| 电介质材料： | 聚酯，金属化 |
| 容差： | ±10% |
| ESR（等效串联电阻）： | * |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 2-DIP |
| 尺寸/尺寸： | 0.354" L x 0.098" W（9.00mm x 2.50mm） |
| 高度 - 座高（最大）： | 0.217"（5.50mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 0.295"（7.50mm） |
| 特点： | 通用 |
| 应用： | * |
| 包装： | 散装 |
| 其它名称： | B32560J6152K000 |
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B32560 ... B32564
General purpose (stacked) SilverCap TM
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 24 of 32
相关PDF资料 |
PDF描述 |
|---|---|
| 445C32E24M00000 | CRYSTAL 24.00000 MHZ 20PF SMD |
| FXO-HC725R-44.2368 | OSC 44.2368 MHZ 2.5V HCMOS SMD |
| B32560J6102K | FILM CAP 1.0NF 10% 400V |
| 445C32D24M00000 | CRYSTAL 24.00000 MHZ 18PF SMD |
| FXO-HC725R-50 | OSC 50 MHZ 2.5V HCMOS SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| B32560J6152K | 制造商:TDK-EPC 功能描述:CAPACITOR 1.5NF 400V |
| B32560J6152K189 | 功能描述:薄膜电容器 1.5NF 10% 400V FILM CAP POLY UNCOAT RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32560J6152K289 | 功能描述:薄膜电容器 1.5nF 10% 400V FILM CAP POLY UNCOAT RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32560J6153J | 功能描述:薄膜电容器 Film Cap 15NF 5% 400VPOLYESTER UNCOATED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32560J6153J000 | 功能描述:薄膜电容器 15NF 5% 400V FILM CAP POLY UNCOAT RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
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