参数资料
型号: B32561J6153J
厂商: EPCOS Inc
文件页数: 24/32页
文件大小: 0K
描述: FILM CAP 15NF 5% 400V
标准包装: 1,500
系列: B32561
电容: 0.015µF
额定电压 - DC: 400V
电介质材料: 聚酯,金属化
容差: ±5%
ESR(等效串联电阻): *
工作温度: -55°C ~ 125°C
安装类型: 通孔
封装/外壳: 2-DIP
端子: PC 引脚
引线间隔: 0.394"(10.00mm)
特点: 通用
应用: *
包装: 散装
其它名称: B32561J6153J000
B32560 ... B32564
General purpose (stacked) SilverCap TM
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 24 of 32
相关PDF资料
PDF描述
445W35A12M00000 CRYSTAL 12.00000 MHZ 10PF SMD
445W35S12M00000 CRYSTAL 12.00000 MHZ SERIES SMD
ASG-D-X-B-212.500MHZ OSC 212.500 MHZ 2.5V LVDS SMD
FXO-HC736R-83.333 OSC 83.333 MHZ 3.3V HCMOS SMD
ASG-D-X-A-212.500MHZ OSC 212.500 MHZ 3.3V LVDS SMD
相关代理商/技术参数
参数描述
B32561J6153J000 功能描述:薄膜电容器 15NF 5% 400V FILM CAP POLY UNCOAT RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32561J6153K 功能描述:薄膜电容器 Film Cap 15NF 10% 400V POLYESTER UNCOATED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32561J6153K000 功能描述:薄膜电容器 15NF 10% 400V FILM CAP POLY UNCOAT RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32561J6154K 功能描述:薄膜电容器 Film Cap 0,15UF 10% 400V POLYESTER UNCOATED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32561J6154K000 功能描述:薄膜电容器 0.15UF 10% 400V FILM CAP POLY UNCOAT RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm