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参数资料
| 型号： | B32572J3684K |
| 厂商： | EPCOS Inc |
| 文件页数： | 9/19页 |
| 文件大小： | 0K |
| 描述： | FILM CAP 0.68UF 10% 250V |
| 标准包装： | 500 |
| 系列： | B32572 |
| 电容： | 0.68µF |
| 额定电压 - AC： | * |
| 额定电压 - DC： | * |
| 电介质材料： | 聚酯，金属化 |
| 容差： | ±10% |
| ESR（等效串联电阻）： | * |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 2-DIP |
| 尺寸/尺寸： | 0.650" L x 0.276" W（16.50mm x 7.00mm） |
| 高度 - 座高（最大）： | 0.433"（11.00mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 0.591"（15.00mm） |
| 特点： | 通用 |
| 应用： | * |
| 包装： | 散装 |
| 其它名称： | B32572J3684K000 |
B32572, B32573
Ignition (stacked) SilverCap TM
Mounting guidelines
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 ° C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
235 ± 5 ° C
2.0 ± 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder ≥ 90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Serie s
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ± 5 ° C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
10 ± 1 s
5 ± 1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 9 of 19
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| B32572A3684K | FILM CAP 0.68UF 10% 250V |
相关代理商/技术参数 |
参数描述 |
|---|---|
| B32572J3684K000 | 功能描述:薄膜电容器 0.68UF 10% 250V FILM CAP MKT SILVER RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32572S3105K541 | 制造商:TDK Epcos 功能描述: |
| B32573A3105J | 功能描述:薄膜电容器 Film Cap 1,0UF 5% 250V MKT SILVER RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32573A3105J000 | 功能描述:薄膜电容器 1.0UF 5% 250V FILM CAP MKT SILVER RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32573A3155J | 功能描述:薄膜电容器 Film Cap 1,5UF 5% 250V MKT SILVER RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
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