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参数资料
| 型号： | B32591C3473J008 |
| 厂商： | EPCOS Inc |
| 文件页数： | 35/43页 |
| 文件大小： | 0K |
| 描述： | CAP FILM 0.047UF 250VDC RADIAL |
| 产品目录绘图： | B3259xC Series Side 1 B3259xC Series Side 2 |
| 标准包装： | 1,500 |
| 系列： | B32591 |
| 电容： | 0.047µF |
| 额定电压 - AC： | 160V |
| 额定电压 - DC： | 250V |
| 电介质材料： | 聚酯，金属化 |
| 容差： | ±5% |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 尺寸/尺寸： | 0.512" L x 0.197" W（13.00mm x 5.00mm） |
| 高度 - 座高（最大）： | 0.354"（9.00mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 0.394"（10.00mm） |
| 特点： | 通用 |
| 包装： | 散装 |
| 产品目录页面： | 2065 (CN2011-ZH PDF) |
| 其它名称： | 495-3124 B32591C3473J 8 B32591C3473J8 |
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B32591 ... B32594
General purpose (stacked/wound)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 18 of 26
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| B32591C3473J8 | 功能描述:薄膜电容器 0.0470UF 5% 250V MKT PD STACKED 10 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32591-C3473-K 8 | 制造商:TDK-EPC 功能描述:Cap Film 0.047uF 250V PET 10% (13 X 5 X 9mm) Radial 10mm 125 制造商:EPCOS 功能描述:Cap Film 0.047uF 250V PET 10% (13 X 5 X 9mm) Radial 10mm 125 |
| B32591C3473K8 | 制造商:TDK-EPC 功能描述:Cap Film 0.047uF 250V PET 10% (13 X 5 X 9mm) Radial 10mm 125 制造商:EPCOS 功能描述:Cap Film 0.047uF 250V PET 10% (13 X 5 X 9mm) Radial 10mm 125 |
| B32591C6103J008 | 功能描述:CAP FILM 10000PF 400VDC RADIAL RoHS:是 类别:电容器 >> 薄膜 系列:B32591 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯，金属化 容差:±3% ESR（等效串联电阻）:- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W（20.70mm x 14.70mm） 高度 - 座高（最大）:1.028"（26.10mm） 端子:PC 引脚 引线间隔:0.394"（10.00mm） 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432 |
| B32591C6103J8 | 功能描述:薄膜电容器 0.0100UF 5% 400V MKT PD STACKED 10 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
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