参数资料
型号: B32621A5224K
厂商: EPCOS Inc
文件页数: 22/28页
文件大小: 0K
描述: FILM CAP 0.2200UF 10% 160V
标准包装: 1,000
系列: B32621
电容: 0.22µF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚丙烯,金属化
容差: ±10%
ESR(等效串联电阻): *
工作温度: -55°C ~ 105°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 0.512" L x 0.236" W(13.00mm x 6.00mm)
高度 - 座高(最大): 0.472"(12.00mm)
端子: PC 引脚
引线间隔: 0.394"(10.00mm)
特点: 交流和双倍脉冲
包装: 散装
其它名称: B32621A5224K000
B32620 ... B32621
High pulse (stacked)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 22 of 28
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B32621A5224K000 功能描述:CAP FILM 0.22UF 10% 160VDC RAD 制造商:epcos (tdk) 系列:B32621 包装:散装 零件状态:在售 电容:0.22μF 容差:±10% 额定电压 - AC:90V 额定电压 - DC:160V 介电材料:聚丙烯(PP),金属化 - 层叠式 工作温度:-55°C ~ 105°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:0.512" 长 x 0.236" 宽(13.00mm x 6.00mm) 高度 - 安装(最大值):0.472"(12.00mm) 端接:PC 引脚 引线间距:0.394"(10.00mm) 应用:高脉冲,DV/DT 等级:- 特性:- 标准包装:4,000
B32621A5224K289 功能描述:薄膜电容器 0.22uF 160volts 10% RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32621A5224M000 功能描述:FILM CAP MKP BOX 0.22F 20% 160VD 制造商:epcos (tdk) 系列:* 零件状态:有效 标准包装:4,000
B32621A5473 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors Metallized Polyester Film Capacitors (MKT)
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