参数资料
型号: B32653A7683K
厂商: EPCOS Inc
文件页数: 33/39页
文件大小: 0K
描述: FILM CAP 68NF 10% 1250V MKP
标准包装: 540
系列: B32653
电容: 6800pF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚丙烯,金属化
容差: ±10%
ESR(等效串联电阻): *
工作温度: -55°C ~ 110°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 1.043" L x 0.413" W(26.50mm x 10.50mm)
高度 - 座高(最大): 0.650"(16.50mm)
端子: PC 引脚
引线间隔: 0.886"(22.50mm)
特点: 交流和双倍脉冲
包装: 散装
其它名称: B32653A7683K000
B32651 ... B32656
High pulse (wound)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 33 of 39
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B32653A7683K000 功能描述:CAP FILM 0.068UF 1.25KVDC RADIAL 制造商:epcos (tdk) 系列:B32653 包装:散装 零件状态:在售 电容:0.068μF 容差:±10% 额定电压 - AC:500V 额定电压 - DC:1250V(1.25kV) 介电材料:聚丙烯(PP),金属化 工作温度:-55°C ~ 100°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:1.043" 长 x 0.413" 宽(26.50mm x 10.50mm) 高度 - 安装(最大值):0.650"(16.50mm) 端接:PC 引脚 引线间距:0.886"(22.50mm) 应用:DC Link,DC 滤波;高脉冲,DV/DT 等级:- 特性:- 标准包装:2,160
B32653A7683K189 功能描述:FILM CAP MKP BOX 68NF 10% 1250VD 制造商:epcos (tdk) 系列:* 零件状态:有效 标准包装:1,600
B32653A8103 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors Metallized Polyester Film Capacitors (MKT)
B32653A8103J 功能描述:薄膜电容器 0.01uF 2KV 5% RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32653A8103J000 功能描述:CAP FILM 10000PF 2KVDC RADIAL RoHS:是 类别:电容器 >> 薄膜 系列:B32653 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯,金属化 容差:±3% ESR(等效串联电阻):- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W(20.70mm x 14.70mm) 高度 - 座高(最大):1.028"(26.10mm) 端子:PC 引脚 引线间隔:0.394"(10.00mm) 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432