参数资料
型号: B32672L8222K
厂商: EPCOS Inc
文件页数: 24/30页
文件大小: 0K
描述: FILM CAP 2.2NF 10% 700VAC MKP
标准包装: 1,000
系列: B32672L
电容: 2200pF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚丙烯,金属化
容差: ±10%
工作温度: -55°C ~ 125°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 0.709" L x 0.197" W(18.00mm x 5.00mm)
高度 - 座高(最大): 0.413"(10.50mm)
端子: PC 引脚
引线间隔: 0.591"(15.00mm)
特点: 交流和双倍脉冲
包装: 散装
其它名称: B32672L8222K000
B32671L ... B32672L
High V AC, high temperature (wound)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 24 of 30
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B32672L8222K000 功能描述:薄膜电容器 2.2NF 10% 700V FILM CAP MKP BOXED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32672L8223A 制造商:TDK Epcos 功能描述:
B32672L8223J 功能描述:薄膜电容器 Film Cap 22NF 5% 700VAC MKP BOXED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32672L8223J000 功能描述:CAP FILM 0.022UF 2KVDC RADIAL RoHS:是 类别:电容器 >> 薄膜 系列:B32672L 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯,金属化 容差:±3% ESR(等效串联电阻):- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W(20.70mm x 14.70mm) 高度 - 座高(最大):1.028"(26.10mm) 端子:PC 引脚 引线间隔:0.394"(10.00mm) 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432
B32672L8223J189 功能描述:薄膜电容器 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm