参数资料
型号: B32674D3475K
厂商: EPCOS Inc
文件页数: 14/22页
文件大小: 0K
描述: CAP FILM 4.7UF 300VDC RADIAL
产品培训模块: Film Capacitors
产品目录绘图: B32zzz(D,E,T) Series Side 1
B32zzz(D,E,T) Series Side 2
标准包装: 1,040
系列: B32674
电容: 4.7µF
额定电压 - AC: 160V
额定电压 - DC: 300V
电介质材料: 聚丙烯,金属化
容差: ±10%
ESR(等效串联电阻): 4.1 毫欧
工作温度: -40°C ~ 105°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 1.240" L x 0.551" W(31.50mm x 14.00mm)
高度 - 座高(最大): 0.965"(24.50mm)
端子: PC 引脚
引线间隔: 1.083"(27.50mm)
特点: 交流和双倍脉冲
包装: 散装
其它名称: 495-2910
B32674D3475K000
B32674 ... B32678
MKP DC link
Mounting guidelines
high power series
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 ° C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
235 ± 5 ° C
2.0 ± 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Serie s
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ± 5 ° C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
10 ± 1 s
5 ± 1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 22
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B32674D3505J 功能描述:FILM CAP 5.0UF 5% 300V MKP RoHS:是 类别:电容器 >> 薄膜 系列:B32674 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯,金属化 容差:±3% ESR(等效串联电阻):- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W(20.70mm x 14.70mm) 高度 - 座高(最大):1.028"(26.10mm) 端子:PC 引脚 引线间隔:0.394"(10.00mm) 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432
B32674D3505J000 功能描述:CAP FILM 5UF 5% 300VDC RADIAL 制造商:epcos (tdk) 系列:B32674 包装:散装 零件状态:在售 电容:5μF 容差:±5% 额定电压 - AC:- 额定电压 - DC:300V 介电材料:聚丙烯(PP),金属化 ESR(等效串联电阻):8.4 mOhms 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:1.240" 长 x 0.591" 宽(31.50mm x 15.00mm) 高度 - 安装(最大值):0.965"(24.50mm) 端接:PC 引脚 引线间距:1.083"(27.50mm) 应用:DC 链路,DC 滤波 等级:- 特性:长寿命 标准包装:1,040