参数资料
型号: B32676E3685K
厂商: EPCOS Inc
文件页数: 16/22页
文件大小: 0K
描述: CAP FILM 6.8UF 300VDC RADIAL
产品培训模块: Film Capacitors
产品目录绘图: B32zzz(D,E,T) Series Side 1
B32zzz(D,E,T) Series Side 2
标准包装: 800
系列: B32676
电容: 6.8µF
额定电压 - AC: 160V
额定电压 - DC: 300V
电介质材料: 聚丙烯,金属化
容差: ±10%
工作温度: -40°C ~ 105°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 1.654" L x 0.630" W(42.00mm x 16.00mm)
高度 - 座高(最大): 1.122"(28.50mm)
端子: PC 引脚
引线间隔: 1.476"(37.50mm)
特点: 交流和双倍脉冲
包装: 散装
其它名称: 495-2948
B32676E3685K000
B32674 ... B32678
MKP DC link
high power series
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 22
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相关代理商/技术参数
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B32676E4106K 功能描述:薄膜电容器 10uF 450volts 10% 37.5mmL/S 1.0mmL/D RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32676E4156K 功能描述:薄膜电容器 15uF 450volts 10% 37.5mmL/S 1.0mmL/D RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32676E4206K 功能描述:薄膜电容器 20uF 450volts 10% 37.5mmL/S 1.0mmL/D RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32676E4225K 功能描述:薄膜电容器 2.2uF 450volts 10% 37.5mmL/S 1.0mmL/D RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32676E4305K 功能描述:薄膜电容器 3.0uF 450volts 10% 37.5mmL/S 1.0mmL/D RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm