参数资料
型号: B32676E8685K
厂商: EPCOS Inc
文件页数: 16/22页
文件大小: 0K
描述: CAP FILM 6.8UF 875VDC RADIAL
产品培训模块: Film Capacitors
产品目录绘图: B32zzz(D,E,T) Series Side 1
B32zzz(D,E,T) Series Side 2
标准包装: 440
系列: B32676
电容: 6.8µF
额定电压 - AC: 400V
额定电压 - DC: 875V
电介质材料: 聚丙烯,金属化
容差: ±10%
工作温度: -40°C ~ 105°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 1.654" L x 1.102" W(42.00mm x 28.00mm)
高度 - 座高(最大): 1.673"(42.50mm)
端子: PC 引脚
引线间隔: 1.476"(37.50mm)
特点: 交流和双倍脉冲
包装: 散装
其它名称: 495-2992
B32676E8685K000
B32674 ... B32678
MKP DC link
high power series
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 16 of 22
相关PDF资料
PDF描述
FXO-LC738-133.333333 OSC 133.333333 MHZ 3.3V LVDS SMD
FXO-LC738-148.5 OSC 148.5 MHZ 3.3V LVDS SMD
B32676G4106K CAP FILM 10UF 450VDC RADIAL
LW3128 SWITCH ROCKER DPDT 10A 125V
SI1902DL-T1-E3 MOSFET N-CH DUAL 20V SC70-6
相关代理商/技术参数
参数描述
B32676E8755K 功能描述:薄膜电容器 7.5uF 875volts 10% 37.5mmL/S 1.0mmL/D RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32676F1106K 功能描述:薄膜电容器 10uF 750volts 10% 4 Pin 37.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32676F3356K 功能描述:FILM CAP 35.000UF 10% 300V MKP RoHS:是 类别:电容器 >> 薄膜 系列:B32676 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯,金属化 容差:±3% ESR(等效串联电阻):- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W(20.70mm x 14.70mm) 高度 - 座高(最大):1.028"(26.10mm) 端子:PC 引脚 引线间隔:0.394"(10.00mm) 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432
B32676F3356K000 功能描述:CAP FILM 35UF 10% 300VDC RADIAL 制造商:epcos (tdk) 系列:B32676 包装:散装 零件状态:在售 电容:35μF 容差:±10% 额定电压 - AC:- 额定电压 - DC:300V 介电材料:聚丙烯(PP),金属化 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 高度 - 安装(最大值):- 端接:PC 引脚 引线间距:1.476"(37.50mm) 应用:DC 链路,DC 滤波 等级:- 特性:长寿命 标准包装:180
B32676G1106K 功能描述:薄膜电容器 10uF 750volts 10% 4 Pin 37.5mmL/S RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm