参数资料
型号: B32778G8456J
厂商: EPCOS Inc
文件页数: 13/21页
文件大小: 0K
描述: FILM CAP 45UF 5% 800V MKP
标准包装: 70
系列: B32778
电容: 45µF
额定电压 - DC: 800V
电介质材料: 聚丙烯,金属化
容差: ±5%
ESR(等效串联电阻): *
工作温度: -40°C ~ 105°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 2.264" L x 1.181" W(57.50mm x 30.00mm)
高度 - 座高(最大): 1.772"(45.00mm)
端子: PC 引脚
引线间隔: 2.067"(52.50mm)
特点: 通用
应用: *
包装: 散装
其它名称: B32778G8456J000
B32774 ... B32778
Mounting guidelines
MKP DC link
high density series
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 ° C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
235 ± 5 ° C
2.0 ± 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Serie s
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ± 5 ° C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
10 ± 1 s
5 ± 1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 21
相关PDF资料
PDF描述
S21AWF SW TOGGLE DPST 15A QUICK CONNECT
D4C0612S SWITCH ROTARY 6P-12POS OPEN FRM
M2042LL3W01 SWITCH TOGGLE 4PDT 6A SPLASH PRF
B32796E8206K FILM CAP 20UF 10% 350V MKP
FXO-HC738-156.249844 OSC 156.249844MHZ 3.3V HCMOS SMD
相关代理商/技术参数
参数描述
B32778G8456J000 功能描述:薄膜电容器 45UF 5% 800V FILM CAP MKP BOXED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32778G8456K 功能描述:薄膜电容器 Film Cap 45 F 10% 800V MKP BOXED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32778G8456K000 功能描述:薄膜电容器 45UF 10% 800V FILM CAP MKP BOXED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32778G8506K 功能描述:FILM CAP 50UF 10% 800V MKP RoHS:是 类别:电容器 >> 薄膜 系列:B32778 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯,金属化 容差:±3% ESR(等效串联电阻):- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W(20.70mm x 14.70mm) 高度 - 座高(最大):1.028"(26.10mm) 端子:PC 引脚 引线间隔:0.394"(10.00mm) 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432
B32778G8556 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors Metallized Polyester Film Capacitors (MKT)