参数资料
型号: B32912B4223M
厂商: EPCOS Inc
文件页数: 11/19页
文件大小: 0K
描述: FILM CAP 22NF 20% 440VAC
标准包装: 1,000
系列: B32912
电容: 0.022µF
额定电压 - AC: 440V
电介质材料: 聚丙烯,金属化
容差: ±20%
工作温度: -40°C ~ 110°C
安装类型: 通孔
封装/外壳: 径向
端子: PC 引脚
引线间隔: 0.591"(15.00mm)
特点: EMI 抑制
应用: *
包装: 散装
其它名称: B32912B4223M000
B32911 ... B32916
X1 / 330 V AC
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Application note for X1 / X2 EMI capacitors
Please read Cautions and warnings and
Important notes at the end of this document.
Page 11 of 19
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B32912B4223M000 功能描述:CAP FILM 0.022UF 20% 440VAC RAD 制造商:epcos (tdk) 系列:B32912 包装:散装 零件状态:在售 电容:0.022μF 容差:±20% 额定电压 - AC:440V 额定电压 - DC:- 介电材料:聚丙烯(PP),金属化 工作温度:-40°C ~ 110°C 安装类型:通孔 封装/外壳:径向 高度 - 安装(最大值):- 端接:PC 引脚 引线间距:0.591"(15.00mm) 应用:EMI,RFI 抑制 等级:X1 特性:- 标准包装:4,000
B32912B5103K 功能描述:10000pF Film Capacitor 530V 1000V (1kV) Polypropylene (PP), Metallized Radial 0.709" L x 0.197" W (18.00mm x 5.00mm) 制造商:epcos (tdk) 系列:B32912 包装:散装 零件状态:有效 电容:10000pF 容差:±10% 额定电压 - AC:530V 额定电压 - DC:1000V(1kV) 介电材料:聚丙烯(PP),金属化 ESR(等效串联电阻):- 工作温度:-40°C ~ 110°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:0.709" 长 x 0.197" 宽(18.00mm x 5.00mm) 高度 - 安装(最大值):0.413"(10.50mm) 端接:PC 引脚 引线间距:0.591"(15.00mm) 应用:EMI,RFI 抑制 特性:达到 X1 安全等级 标准包装:4,000
B32912B5103K000 功能描述:CAP FILM 10000PF 10% 1KVDC RAD 制造商:epcos (tdk) 系列:B32912 包装:散装 零件状态:在售 电容:10000pF 容差:±10% 额定电压 - AC:530V 额定电压 - DC:1000V(1kV) 介电材料:聚丙烯(PP),金属化 工作温度:-40°C ~ 110°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:0.709" 长 x 0.197" 宽(18.00mm x 5.00mm) 高度 - 安装(最大值):0.413"(10.50mm) 端接:PC 引脚 引线间距:0.591"(15.00mm) 应用:EMI,RFI 抑制 等级:X1 特性:- 标准包装:4,000
B32912B5103M000 功能描述:FILM CAP MKP X1 10NF 20% 530VAC 制造商:epcos (tdk) 系列:* 零件状态:有效 标准包装:4,000
B32912B5333K 功能描述:0.033μF Film Capacitor 530V 1000V (1kV) Polypropylene (PP), Metallized Radial 0.709" L x 0.276" W (18.00mm x 7.00mm) 制造商:epcos (tdk) 系列:B32912 包装:散装 零件状态:有效 电容:0.033μF 容差:±10% 额定电压 - AC:530V 额定电压 - DC:1000V(1kV) 介电材料:聚丙烯(PP),金属化 ESR(等效串联电阻):- 工作温度:-40°C ~ 110°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:0.709" 长 x 0.276" 宽(18.00mm x 7.00mm) 高度 - 安装(最大值):0.492"(12.50mm) 端接:PC 引脚 引线间距:0.591"(15.00mm) 应用:EMI,RFI 抑制 特性:达到 X1 安全等级 标准包装:4,000