参数资料
型号: B32921C3223M189
厂商: EPCOS Inc
文件页数: 12/22页
文件大小: 0K
描述: FILM CAP 22NF 20% 305VAC MKPX2
标准包装: 1,700
系列: B32921
电容: 0.022µF
额定电压 - AC: 305V
电介质材料: 聚丙烯
容差: ±20%
工作温度: -40°C ~ 110°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 0.512" L x 0.158" W(13.00mm x 4.00mm)
高度 - 座高(最大): 0.354"(9.00mm)
端子: PC 引脚
引线间隔: 0.394"(10.00mm)
特点: EMI 抑制
应用: *
包装: 带卷 (TR)
B32921C/D ... B32928C/D
X2 / 305 V AC
Mounting guidelines
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 ° C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
235 ± 5 ° C
2.0 ± 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Serie s
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ± 5 ° C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
10 ± 1 s
5 ± 1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 22
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