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参数资料
| 型号： | B32923C3824K289 |
| 厂商： | EPCOS Inc |
| 文件页数： | 12/22页 |
| 文件大小： | 0K |
| 描述： | FILM CAP 0.82UF 10% 305V MKP X2 |
| 标准包装： | 390 |
| 系列： | B32923 |
| 电容： | 0.82µF |
| 额定电压 - AC： | 305V |
| 电介质材料： | 聚丙烯 |
| 容差： | ±10% |
| 工作温度： | -40°C ~ 110°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 端子： | PC 引脚 |
| 引线间隔： | 0.886"（22.50mm） |
| 特点： | EMI 抑制 |
| 应用： | * |
| 包装： | 带盒（TB） |
B32921C/D ... B32928C/D
X2 / 305 V AC
Mounting guidelines
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 ° C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
235 ± 5 ° C
2.0 ± 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder ≥ 90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Serie s
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ± 5 ° C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
10 ± 1 s
5 ± 1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 12 of 22
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相关代理商/技术参数 |
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| B32923C3824K783 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors EMI Suppression Capacitors (MKP) |
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