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参数资料
| 型号： | B32924D3225K |
| 厂商： | EPCOS Inc |
| 文件页数： | 14/22页 |
| 文件大小： | 0K |
| 描述： | FILM CAP 2.2UF 10% 305V MKP X2 |
| 标准包装： | 240 |
| 系列： | B32924 |
| 电容： | 2.2µF |
| 额定电压 - AC： | 305V |
| 电介质材料： | 聚丙烯 |
| 容差： | ±10% |
| 工作温度： | -40°C ~ 110°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 端子： | PC 引脚 |
| 引线间隔： | 1.083"（27.50mm） |
| 特点： | EMI 抑制 |
| 应用： | * |
| 包装： | 散装 |
| 其它名称： | B32924D3225K000 |
B32921C/D ... B32928C/D
X2 / 305 V AC
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Application note for X1 / X2 EMI capacitors
Please read Cautions and warnings and
Important notes at the end of this document.
Page 14 of 22
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相关代理商/技术参数 |
参数描述 |
|---|---|
| B32924D3225K000 | 功能描述:CAP FILM 2.2UF 10% 305VAC RADIAL 制造商:epcos (tdk) 系列:B32924 包装:散装 零件状态:在售 电容:2.2μF 容差:±10% 额定电压 - AC:305V 额定电压 - DC:- 介电材料:聚丙烯（PP），金属化 工作温度:-40°C ~ 110°C 安装类型:通孔 封装/外壳:径向 高度 - 安装（最大值）:- 端接:PC 引脚 引线间距:1.083"（27.50mm） 应用:EMI，RFI 抑制 等级:X2 特性:- 标准包装:960 |
| B32924D3225K3 | 制造商:TDK Epcos 功能描述: |
| B32924D3225M | 功能描述:薄膜电容器 2.2uF 305volts 20% X2 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
| B32924D3225M000 | 功能描述:CAP FILM 2.2UF 20% 305VAC RADIAL 制造商:epcos (tdk) 系列:B32924 包装:散装 零件状态:在售 电容:2.2μF 容差:±20% 额定电压 - AC:305V 额定电压 - DC:- 介电材料:聚丙烯（PP），金属化 工作温度:-40°C ~ 110°C 安装类型:通孔 封装/外壳:径向 高度 - 安装（最大值）:- 端接:PC 引脚 引线间距:1.083"（27.50mm） 应用:EMI，RFI 抑制 等级:X2 特性:- 标准包装:960 |
| B32924D3335K | 功能描述:薄膜电容器 3.3uF 305volts 10% X2 RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm |
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