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参数资料
| 型号： | B32933A3224K |
| 厂商： | EPCOS Inc |
| 文件页数： | 10/16页 |
| 文件大小： | 0K |
| 描述： | FILM CAP 0.22UF 10% 305V MKT X2 |
| 标准包装： | 630 |
| 系列： | B32933 |
| 电容： | 0.22µF |
| 额定电压 - AC： | 305V |
| 电介质材料： | 聚酯，金属化 |
| 容差： | ±10% |
| ESR（等效串联电阻）： | * |
| 工作温度： | 105°C 最小值 |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 尺寸/尺寸： | 1.043" L x 0.276" W（26.50mm x 7.00mm） |
| 高度 - 座高（最大）： | 0.630"（16.00mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 0.886"（22.50mm） |
| 特点： | EMI 抑制 |
| 应用： | * |
| 包装： | 散装 |
| 其它名称： | B32933A3224K000 |
B32932 ... B32936
AC applications (heavy duty series) / 305 V AC
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 10 of 16
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相关代理商/技术参数 |
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| B32933A3224K000 | 功能描述:CAP FILM 0.22UF 10% 305VAC RAD 制造商:epcos (tdk) 系列:B32933 包装:散装 零件状态:在售 电容:0.22μF 容差:±10% 额定电压 - AC:305V 额定电压 - DC:- 介电材料:聚酯，金属化 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:1.043" 长 x 0.276" 宽（26.50mm x 7.00mm） 高度 - 安装（最大值）:0.630"（16.00mm） 端接:PC 引脚 引线间距:0.886"（22.50mm） 应用:汽车级；EMI、RFI 抑制 等级:AEC-Q200，X2 特性:- 标准包装:2,520 |
| B32933A3224K189 | 制造商:TDK Epcos 功能描述: |
| B32933A3224M | 功能描述:FILM CAP 0.22UF 20% 305V MKT X2 RoHS:是 类别:电容器 >> 薄膜 系列:B32933 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯，金属化 容差:±3% ESR（等效串联电阻）:- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W（20.70mm x 14.70mm） 高度 - 座高（最大）:1.028"（26.10mm） 端子:PC 引脚 引线间隔:0.394"（10.00mm） 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432 |
| B32933A3224M000 | 功能描述:CAP FILM 0.22UF 20% 305VAC RAD 制造商:epcos (tdk) 系列:B32933 包装:散装 零件状态:在售 电容:0.22μF 容差:±20% 额定电压 - AC:305V 额定电压 - DC:- 介电材料:聚酯，金属化 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:1.043" 长 x 0.276" 宽（26.50mm x 7.00mm） 高度 - 安装（最大值）:0.630"（16.00mm） 端接:PC 引脚 引线间距:0.886"（22.50mm） 应用:汽车级；EMI、RFI 抑制 等级:AEC-Q200，X2 特性:- 标准包装:2,520 |
| B32933A3334 | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors Metallized Polyester Film Capacitors |
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