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参数资料
| 型号： | B37931K5331K060 |
| 厂商： | EPCOS Inc |
| 文件页数： | 24/25页 |
| 文件大小： | 0K |
| 描述： | CAP CER 330PF 50V 10% X7R 0603 |
| 标准包装： | 100,000 |
| 系列： | B37931K |
| 电容： | 330pF |
| 电压 - 额定： | 50V |
| 容差： | ±10% |
| 温度系数： | X7R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 自动 |
| 额定值： | AEC-Q200 |
| 封装/外壳： | 0603（1608 公制） |
| 尺寸/尺寸： | 0.063" L x 0.031" W（1.60mm x 0.80mm） |
| 厚度（最大）： | 0.035"（0.90mm） |
| 包装： | 带卷 (TR) |
| 其它名称： | B37931K5331K 60 B37931K5331K60 |
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
23
10/06
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相关代理商/技术参数 |
参数描述 |
|---|---|
| B37931K5331K070 | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 330PF +/-10% MLCC RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| B37931K5331K60 | 功能描述:多层陶瓷电容器MLCC - SMD/SMT MLCC 0603X7R331K050P07 330PF +/-10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| B37931-K5331-K60 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Multilayer Chip Capacitors |
| B37931K5331K70 | 功能描述:多层陶瓷电容器MLCC - SMD/SMT MLCC 0603X7R331K050P13 330PF +/-10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| B37931-K5332-K | 制造商:TDK Epcos 功能描述: |
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