参数资料
型号: B37987M5224K051
厂商: EPCOS Inc
文件页数: 14/15页
文件大小: 0K
描述: CAP CER 0.22UF 50V 10% RADIAL
产品目录绘图: B379_6.5 x 5.0 x 2.5 x 2.5
标准包装: 10
系列: B37987M
电容: 0.22µF
电压 - 额定: 50V
容差: ±10%
温度系数: X7R
安装类型: 通孔
工作温度: -55°C ~ 125°C
应用: 自动
额定值: AEC-Q200
封装/外壳: 径向
尺寸/尺寸: 0.256" L x 0.197" W(6.50mm x 5.00mm)
高度 - 座高(最大): 0.098"(2.50mm)
引线间隔: 0.098"(2.50mm)
包装: 剪切带 (CT)
引线型: 纽结
其它名称: 495-3410-1
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
13
10/06
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