- 您现在的位置：买卖IC网 > Datasheet目录205 > B3FS-4002P (Omron Electronics Inc-EMC Div)SWITCH TACT SPST-NO 0.05A 24V Datasheet资料下载
参数资料
| 型号： | B3FS-4002P |
| 厂商： | Omron Electronics Inc-EMC Div |
| 文件页数： | 3/4页 |
| 文件大小： | 0K |
| 描述： | SWITCH TACT SPST-NO 0.05A 24V |
| 特色产品： | B3FS-4 SMD Tactile Switch |
| 标准包装： | 1 |
| 系列： | B3FS-4 |
| 电路： | SPST-NO |
| 开关功能： | 关-瞬时 |
| 触点额定电压： | 0.05A @ 24VDC |
| 触动器类型： | 标准 |
| 安装类型： | 表面贴装 |
| 从引脚算起，致动器距离 PCB 的高度： | 4.30mm |
| 致动器方向： | 顶部触动 |
| 端接类型： | 鸥翼型 |
| 外形： | 12.00mm x 12.00mm |
| 发光： | 不发光 |
| 操作力： | 150gf |
| 包装： | 标准包装 |
| 开关行程： | 0.25mm |
| 机械寿命： | 3,000,000 次循环 |
| 工作温度： | -25°C ~ 70°C |
| 其它名称： | SW1278DKR |
■ Precautions
Be sure to read the safety precautions common to all Tactile Switches for correct use.
Precautions for Correct Use
● PCBs
If the PCBs are separated after mounting the Switch, particles
from the PCBs may enter the Switch. If PCB particles or foreign
particles from the surrounding environment, workbench, contain-
ers, or stacked PCBs become attached to the Switch, contact
failure may result.
● Soldering
1. General Precautions
Before soldering the Switch on a multilayer PCB, test to confirm
that soldering can be performed properly. Otherwise the Switch
may be deformed by the soldering heat on the pattern or lands of
● Packaging Specifications for Embossed Taping
(29)
Tape dra w ing direction
?13.2
the multilayer PCB.
Reel (Material: PS)
La b el
?3 8 0 ±2
Do not solder the Switch more than twice, including rectification
soldering. An interval of five minutes is required between the first
and the second soldering, or it may result in melting housing and
B3FS-4002P
B3FS-4005P
deterioration of operating characteristics.
1.5 +0.10 dia.
16 ±0.1
4 ±0.1
2
A
1.75
(5.6)
2.Reflow Soldering (Surface Mounting)
Solder the terminals within the heating curve shown in the follow-
ing diagram.
250 max.
220
1 8 0
B3FS-4052P
B3FS-4055P
Tape dra w ing direction
A
11.5
24
150
Preheating
Heating
1.5 +0.10 dia.
16 ±0.1
4 ±0.1
2
A
1.75
( 8 .5)
Room
11.5
tempert u re
60 to 120
Max.60
24
Time (s)
Note: The above heating curve applies if the PCB thickness is 1.6 mm.
The peak temperature may vary depending on the reflow bath
used. Confirm the conditions beforehand.
Do not use an automatic soldering bath for surface-mounted
Switches. The soldering gas or flux may enter the Switch and
damage the Switch's plunger operation.
3. Manual Soldering
Soldering temperature: 350 degC max. at the tip of the soldering
iron Soldering time: 3 s max. for a 1.6-mm thick, single-side PCB
Before soldering the Switch on a PCB, make sure that there is no
unnecessary space between the Switch and the PCB.
● Washing
This switch cannot be washed.
Doing so will cause the washing agent, together with flux or dust
particles on the PCB, to enter the Switch, resulting in malfunc-
tion.
A
Tape dra w ing direction
● RoHS Compliant
The “RoHS Compliant” designation indicates that the listed mod-
els do not contain the six hazardous substances covered by the
RoHS Directive.
Reference:
The following standards are used to determine compliance for
the six substances.
Lead: 1,000 ppm max.
Mercury: 1,000 ppm max.
Cadmium: 100 ppm max.
Hexavalent chromium: 1,000 ppm max.
PBB: 1,000 ppm max.
PBDE: 1,000 ppm max.
SMD Tactile Switch
B3FS-4000
3
相关PDF资料 |
PDF描述 |
|---|---|
| B3J-7400 | SWITCH PUSH SPST-NO 0.05A 24V |
| B3M-6009 | SWITCH TACTILE SPST-NO 0.05A 12V |
| B3S-1002 BY OMZ | SWITCH TACTILE SPST-NO 0.05A 24V |
| B3SL-1022P | SWITCH TACTILE SPST-NO 0.05A 12V |
| B3U-1000P-B | SWITCH TACTILE SPST-NO 0.05A 12V |
相关代理商/技术参数 |
参数描述 |
|---|---|
| B3G12 | 制造商:Burndy 功能描述:3X BRAID 12 1.50 C-C 960 |
| B3G12N | 制造商:Burndy 功能描述:3X BRAID 12 1.75 C-C 960 |
| B3-GTE-H | 制造商:Banner Engineering 功能描述:B3-GTE-H MODULE |
| B3J | 制造商:OMRON 制造商全称:Omron Electronics LLC 功能描述:Mechanical Key Switch(Hinged) |
| B3J_1 | 制造商:OMRON 制造商全称:Omron Electronics LLC 功能描述:Tactile Switch (Hinged Type) |
发布紧急采购，3分钟左右您将得到回复。