参数资料
型号: B72500D300H60
厂商: EPCOS Inc
文件页数: 15/22页
文件大小: 0K
描述: CERADIODE 30VDC 10PF 0603
产品培训模块: Ceramic TVS
产品目录绘图: B72_0603 Series Side 1
B72_0603 Series Side 2
标准包装: 1
系列: CeraDiode
变阻器电压: 50V
电路数: 1
最大直流电压: 30VDC
封装/外壳: 0603(1608 公制)
产品目录页面: 2358 (CN2011-ZH PDF)
其它名称: 495-3421-6
CeraDiodes
High-speed series
4
Solderability tests
Test
Standard
Test conditions /
Test conditions /
Criteria / test results
Sn-Pb soldering
Pb-free soldering
Wettability
IEC
Immersion in
Immersion in
Covering of 95%
60068-2-58 60/40 SnPb solder
using non-activated
flux at 215 ± 3 ° C for
3 ± 0.3 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ± 5 ° C
for 3 ± 0.3 s
of end termination,
checked by visual
inspection
Leaching
IEC
Immersion in
Immersion in
No leaching of
resistance
60068-2-58 60/40 SnPb
solder using
mildly activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
contacts
Tests of
IEC
Immersion in
Immersion in
Capacitance change:
resistance to
soldering heat
60068-2-58 60/40 SnPb for 10 s
at 260 ° C
Sn96.5Ag3.0Cu0.5
for 10 s at 260 ° C
15% ≤? C ≤ 15%
for SMDs
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on the substrate.
As single chip
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 22
As mounted on substrate
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