参数资料
| 型号： | BA00CC0WT |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 12/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 1A TO220FP-5 |
| 标准包装： | 500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 4 V ~ 25 V |
| 电压 - 压降（标准）： | 0.3V @ 500mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1A（最小值） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-220-5 整包 |
| 供应商设备封装： | TO-220FP-5 |
| 包装： | 管件 |
BA00DD0xx series BA00CC0xx series
● Power Dissipation
HRP5
To225FP-5
TO220FP-5
Datasheet
Board size : 70 × 70 × 1.6 ㎜
（ board contains a thermal ）
Board front copper foil area : 10.5 × 10.5 ㎜
① 2-layer board (back surface copper foil area :15 × 15 ㎜ )
② 2-layer board (back surface copper foil area :70 × 70 ㎜ )
③ 4-layer board (back surface copper foil area :70 × 70 ㎜ )
10
9
8
3
2
2
2
2
25
20
（ 1 ）
（ 2 ）
（ 1 ） 20.0
When using a maximum heat sick : θ j-c=6.25( ℃ /W)
When using an IC alone : θ j-c=62.5( ℃ /W)
7
6
5
4
3
③ 7.3W
② 5.5W
15
10
2
1
0
① 2.3W
5
0
（ 2 ） 2.0
0
25
50 75 100
125
150
0
25
50 75 100
125
150
TO252-5
Ambient temperature:Ta(℃）
Fig.28
Ambient temperature:Ta(℃）
Fig.29
2.0
Mounted on a Rohm standard board
Board size : 70 × 70 × 1.6 ㎜
Copper foil area :7 × 7 ㎜
TO252-5 θ ja=96.2( ℃ /W)
1.6
1.2
0.8
0.4
0.0
1.30
0
25
50 75 100
125
150
Ambient temperature:Ta(℃）
Fig.30
When using at temperatures over Ta=25 ℃ , please refer to the heat reducing characteristics shown in Fig.28 through 30.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature Tj MAX .
Fig.29 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25 ℃ ), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows:
Pc = (Vcc-Vo) × Io ＋ Vcc × Icca
Acceptable loss Pd ≦ Pc
Solving this for load current Io in order to operate within the acceptable loss,
Vcc ： Input voltage
Vo ： Output voltage
Io ： Load current
Icca ： Circuit current
Io ≦ Pd – Vcc × Icca
Vcc － Vo
（ Please refer to Fig.8 and 20 for Icca. ）
It is then possible to find the maximum load current Io MAX with respect to the applied voltage Vcc at the time of thermal design.
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TSZ22111 ? 15 ? 001
12/17
TSZ02201-0R6R0A600080-1-2
25.July.2013 Rev.002
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